Electronic apparatus and exterior panel thereof

ABSTRACT

An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Japanese Priority PatentApplication JP 2020-059187 filed Mar. 27, 2020, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND

The present disclosure relates to an exterior member of an electronicapparatus.

PCT Patent Publication No. WO2014/185311 discloses an electronicapparatus that functions as a game machine. The electronic apparatushas, as exterior members thereof, an upper cover that covers the upperside of internal devices such as a circuit board, a power supply unit,and a heat sink, and a lower cover that covers the lower side of theinternal devices.

SUMMARY

The electronic apparatus preferably retains the beauty of an exteriorthereof over a long period of time. When the electronic apparatus isplaced vertically, for example, the side surface of an apparatus mainbody is preferably protected appropriately.

An electronic apparatus according to an embodiment of the presentdisclosure includes an apparatus main body having a first externalsurface that faces a first direction and a first side surface that facesa second direction orthogonal to the first direction, and a firstexterior panel curved at least partly. The first exterior panel coversthe first external surface and is attached to the first externalsurface. The first exterior panel has, at an end portion of the firstexterior panel, a first projecting portion beyond a position of thefirst side surface. According to this electronic apparatus, theapparatus main body can be protected by the exterior panel when theelectronic apparatus is placed such that the first side surface is onthe lower side.

An exterior panel according to another embodiment of the presentdisclosure is a panel that is attached to a housing and disposed in afirst direction with respect to the housing, the housing having a firstexternal surface that faces the first direction and a first side surfacethat faces a second direction orthogonal to the first direction. Theexterior panel is curved at least partly and includes a plurality ofattachment target portions to be individually attached to a plurality ofattachment portions formed in the first external surface of the housing,and, at an end portion of the exterior panel, a first projecting portionbeyond a position of the first side surface. According to this exteriorpanel, the apparatus main body can be protected by the exterior panelwhen the electronic apparatus is placed such that the first side surfaceis on the lower side.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view illustrating an example of an electronicapparatus according to an embodiment of the present disclosure;

FIG. 1B is a perspective view illustrating the electronic apparatus;

FIG. 1C is a front view illustrating the electronic apparatus;

FIG. 1D is a plan view illustrating the electronic apparatus;

FIG. 1E is a right side view illustrating the electronic apparatus;

FIG. 1F is a left side view illustrating the electronic apparatus;

FIG. 1G is a rear view illustrating the electronic apparatus;

FIG. 1H is a bottom view illustrating the electronic apparatus;

FIG. 2A is an exploded perspective view illustrating an apparatus mainbody and upper and lower exterior panels that are included in theelectronic apparatus, in a disassembled state;

FIG. 2B is an exploded perspective view illustrating the apparatus mainbody and the upper and lower exterior panels that are included in theelectronic apparatus, in a disassembled state;

FIG. 3 is an exploded perspective view illustrating internal devices ofthe electronic apparatus;

FIG. 4 is an exploded perspective view of a housing and a front coverthat are included in the apparatus main body;

FIG. 5 is a perspective view illustrating the inside of an upper housingmember;

FIG. 6A is a plan view of the apparatus main body;

FIG. 6B is a plan view illustrating positional relation between an airflow passage and parts formed on the upper side of a circuit board;

FIG. 7A is a sectional view of the apparatus main body, the sectionalview being obtained in a cutting plane indicated by a line VIIa-VIIa inFIG. 6B;

FIG. 7B is a sectional view of the apparatus main body, the sectionalview being obtained in a cutting plane indicated by a line VIIb-VIIb inFIG. 6B;

FIG. 7C is a sectional view of the apparatus main body, the sectionalview being obtained in a cutting plane indicated by a line VIIc-VIIc inFIG. 6B;

FIG. 8A is a bottom view of the apparatus main body;

FIG. 8B is a bottom view illustrating positional relation between an airflow passage and parts formed on the lower side of the circuit board;

FIG. 9 is a sectional view of the apparatus main body, the sectionalview being obtained in a cutting plane indicated by a line IX-IX in FIG.7A;

FIG. 10A is a plan view of a fan guard;

FIG. 10B is a sectional view of the fan guard and a cooling fan, thesectional view being indicated by a line Xb-Xb in FIG. 10A;

FIG. 11A is a perspective view of a power supply unit;

FIG. 11B is a sectional view of an intake air wall and a side wall;

FIG. 12 is a sectional view of the apparatus main body, the sectionalview being obtained in a cutting plane indicated by a line XII-XII inFIG. 6B;

FIG. 13A is a plan view of a heat radiating device disposed on the upperside of the circuit board, the heat radiating device being illustratedin FIG. 3;

FIG. 13B is a bottom view of the heat radiating device illustrated inFIG. 13A, in which a base plate that supports fins is omitted;

FIG. 14A is a sectional view of the heat radiating device and thecircuit board, the sectional view being obtained in a cutting planeindicated by a line XIVa-XIVa in FIG. 13A;

FIG. 14B is a sectional view of the heat radiating device, the sectionalview being obtained in a cutting plane indicated by a line XIVb-XIVb inFIG. 13A;

FIG. 14C is a sectional view of the heat radiating device and thecircuit board, the sectional view being obtained in a cutting planeindicated by a line XIVc-XIVc in FIG. 13B;

FIG. 15 is a view illustrating the lower surface of the circuit board;

FIG. 16A is a sectional view of the circuit board and a board shield,the sectional view being indicated by a line XVIa-XVIa in FIG. 15, andillustrates a side surface of the heat radiating device;

FIG. 16B is a diagram (plan view) of the heat radiating device as viewedfrom the circuit board side;

FIG. 17A is a diagram (plan view) of a heat radiating device accordingto a modification as viewed from the circuit board side;

FIG. 17B is a sectional view obtained in a cutting plane indicated by aline XVIIb-XVIIb in FIG. 17A;

FIG. 17C is a side view of the heat radiating device according to themodification;

FIG. 18A is a sectional view obtained in a cutting plane indicated by aline XVIIIa-XVIIIa in FIG. 8A;

FIG. 18B is a sectional view obtained in a cutting plane indicated by aline XVIIIb-XVIIIb in FIG. 18A;

FIG. 18C is a sectional view obtained in a cutting plane indicated by aline XVIIIc-XVIIIc in FIG. 18A;

FIG. 19 is a plan view illustrating a memory housing chamber, in whichthe board shield is depicted;

FIG. 20A is a sectional view of the exterior panels and the housing, thesectional view being obtained in a cutting plane indicated by a lineXXa-XXa in FIG. 1D;

FIG. 20B is a sectional view of the exterior panels and the housing, thesectional view being obtained in a cutting plane indicated by a lineXXb-XXb in FIG. 1D;

FIG. 21A is a sectional view of exterior panels and a housing of anelectronic apparatus not including an optical disk drive, in which acutting plane of the sectional view is the same as the cutting planeindicated by the line XXa-XXa in FIG. 1D;

FIG. 21B is a sectional view of the exterior panels and the housingillustrated in FIG. 21A, in which a cutting plane of the sectional viewis the same as the cutting plane indicated by the line XXb-XXb in FIG.1D;

FIG. 21C is a front view of the electronic apparatus illustrated in FIG.21A;

FIG. 22 is a sectional view of the upper exterior panel and the upperhousing member, the sectional view being obtained in a cutting planeindicated by a line XX-XX in FIG. 1D;

FIG. 23 is a schematic diagram of assistance in explaining an attachmentstructure of the upper exterior panel and the upper housing member;

FIG. 24 is a perspective view of assistance in explaining a modificationof the attachment structure of the upper exterior panel and the upperhousing member;

FIG. 25 is a sectional view of the electronic apparatus, the sectionalview being obtained in a cutting plane indicated by a line XXV-XXV inFIG. 1C;

FIG. 26A is a plan view illustrating a modification of the heatradiating device illustrated in FIG. 13A;

FIG. 26B is a side view of the heat radiating device illustrated in FIG.26A and is a view of the heat radiating device as viewed in a directionof an arrow indicated by XXVIb in the figure;

FIG. 26C is a plan view of the heat radiating device illustrated in FIG.26A, in which heat sinks are omitted; and

FIG. 27 is a plan view of an apparatus main body including the heatradiating device illustrated in FIG. 26A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

An embodiment of the present disclosure will hereinafter be describedwith reference to the drawings. FIGS. 1A to 1H and the like illustratean electronic apparatus 1 as an example of the embodiment. In thefollowing description, X1 and X2 illustrated in FIGS. 1A to 1H will beset as a right direction and a left direction, respectively, Y1 and Y2will be set as a forward direction and a rearward direction,respectively, and Z1 and Z2 will be set as an upward direction and adownward direction, respectively. However, these directions are definedto describe the shape, relative positional relation, movement, and thelike of elements (parts, members, and portions) of the electronicapparatus 1 and do not limit the attitude of the electronic apparatus 1at a time of usage. For example, while FIG. 1A and the like illustratethe electronic apparatus 1 in a horizontal placement attitude, theelectronic apparatus 1 may be disposed in a vertical placement attitudeat a time of usage. (The “vertical placement attitude” is an attitude inwhich the right side surface or left side surface of the electronicapparatus 1 is a lower side.)

The electronic apparatus 1 is, for example, an entertainment device thatfunctions as a game device or an audio-visual apparatus. The electronicapparatus 1 outputs, to a display device such as a television, movingimage data generated by executing a game program, video and audio dataobtained through a network, and video and audio data obtained from arecording medium such as an optical disk. The electronic apparatus may,for example, be a personal computer.

[General Configuration]

As illustrated in FIG. 2A, the electronic apparatus 1 includes anapparatus main body 10, an upper exterior panel 20A that covers theupper side of the apparatus main body 10, and a lower exterior panel 20Bthat covers the lower side of the apparatus main body 10. As illustratedin FIG. 3, the apparatus main body 10 includes a circuit board 50,internal devices such as a heat radiating device 70, and a housing 30that houses the internal devices. The housing 30 includes an upperhousing member 30A that covers the upper side of the circuit board 50,and a lower housing member 30B that covers the lower side of the circuitboard 50. These housings are combined with each other in anupward-downward direction. The upper housing member 30A forms the uppersurface of the apparatus main body 10. The lower housing member 30Bforms the lower surface of the apparatus main body 10. The upperexterior panel 20A may be detachable from the upper housing member 30A.The lower exterior panel 20B may be detachable from the lower housingmember 30B. The exterior panels 20A and 20B and the housing members 30Aand 30B include, for example, a resin such as an acrylonitrile butadienestyrene (ABS) resin or a polycarbonate.

As illustrated in FIG. 1A, the apparatus main body 10 may have a powerbutton 2 a and an optical disk ejecting button 2 b in the front surfaceof the apparatus main body 10. The apparatus main body 10 may also haveconnectors 3 a and 3 b in the front surface thereof. Further, theapparatus main body 10 may have connectors 4 a to 4 e (see FIG. 1G) inthe back surface of the apparatus main body 10.

As illustrated in FIG. 3, the apparatus main body 10 includes, asinternal devices, a cooling fan 5, the heat radiating device 70, and anoptical disk drive 6 in addition to the circuit board 50 and a powersupply unit 60. As will be described later, the heat radiating device 70includes heat sinks 71 and 72 (see FIG. 6B) and heat pipes 73A to 73F(see FIG. 13B). The upper surface of the circuit board 50 is covered byan upper board shield 51 that blocks electromagnetic waves fromelectronic parts mounted on the upper surface. The lower surface of thecircuit board 50 is covered by a lower board shield 52 that blockselectromagnetic waves from electronic parts mounted on the lowersurface. The board shields 51 and 52 are respectively attached to theupper surface and lower surface of the circuit board 50. The boardshields 51 and 52 are a metallic plate. The material of the metallicplates may be, for example, iron, stainless steel, aluminum, or thelike.

[Outline of Part Layout]

The power supply unit 60 and the heat radiating device 70 are, forexample, disposed on the upper side of the circuit board 50 (morespecifically, on the upper side of the upper board shield 51). Anintegrated circuit 50 a (see FIG. 3) that functions as a centralprocessing unit (CPU), a graphics processing unit (GPU), or the like ismounted on the upper surface of the circuit board 50. The integratedcircuit 50 a is a heat generating device and is connected to the heatradiating device 70. The power supply unit 60 is also a heat generatingdevice. An airflow generated by the cooling fan 5 is supplied to theheat radiating device 70 and the power supply unit 60. The layout ofinternal devices such as the heat radiating device 70, the power supplyunit 60, and the cooling fan 5 is not limited to the example of theelectronic apparatus 1.

The optical disk drive 6 is, for example, disposed on the lower side ofthe circuit board 50 (more specifically, on the lower side of the lowerboard shield 52). A heat radiating device 80 (see FIG. 7A) may bedisposed on the lower side of the circuit board 50. An electronic part(for example, a power transistor that generates driving power for theintegrated circuit 50 a) is mounted on the lower surface of the circuitboard 50. The heat radiating device 80 may be connected to thiselectronic part.

[Cooling Fan]

As illustrated in FIG. 7A, the cooling fan 5 is disposed such that arotational center line Cf of the cooling fan 5 is along the thicknessdirection of the circuit board 50 (upward-downward direction in theelectronic apparatus 1). In addition, the cooling fan 5 is disposed onthe outside of an outer edge of the circuit board 50. The cooling fan 5is, for example, disposed on the right side of a right edge of thecircuit board 50. In the description here, the upward-downward directionof the electronic apparatus 1 is a direction along a normal to thecircuit board 50. In addition, directions referred to in the presentspecification do not limit the attitude of the electronic apparatus 1 ata time of usage. Hence, in a case where the electronic apparatus 1 isdisposed in a vertical placement attitude, for example, the rotationalcenter line Cf of the cooling fan 5 is a line along a left-rightdirection.

The cooling fan 5 may have a part located above a horizontal plane Hp1including the circuit board 50 and a part located below the horizontalplane Hp1 including the circuit board 50. More specifically, a pluralityof fins 5 a that rotate about the rotational center line Cf may eachhave a part 5 b located above the horizontal plane Hp1 and a part 5 clocated below the horizontal plane Hp1. This arrangement of the coolingfan 5 can generate an airflow F1 along the upper surface of the circuitboard 50 and an airflow F2 along the lower surface of the circuit board50. It is therefore possible to cool heat generating devices arranged ormounted on the upper side of the circuit board 50 and heat generatingdevices arranged or mounted on the lower side of the circuit board 50without increasing the number of parts.

As illustrated in FIG. 2A, the upper housing member 30A has an upperinlet port 31 a located on the upper side of the cooling fan 5. Asillustrated in FIG. 2B, the lower housing member 30B has a lower inletport 31 b located on the lower side of the cooling fan 5. By thusrespectively forming the inlet ports 31 a and 31 b in the upper surfaceand lower surface of the housing 30, it is possible to take air into theinside of the housing 30 efficiently.

An amount of heat generation of the heat generating devices arranged onthe upper surface of the circuit board 50 may be larger than an amountof heat generation of the heat generating devices arranged on the lowersurface of the circuit board 50. For example, a total amount of heatgeneration of the integrated circuit 50 a and the power supply unit 60arranged on the upper surface of the circuit board 50 may be larger thana total amount of heat generation of electronic parts 50 c (for example,a power transistor and an integrated circuit such as a memory) arrangedon the lower surface of the circuit board 50. When the heat generatingdevices are thus arranged, a center Ch of the cooling fan 5 in theupward-downward direction may be located above the horizontal plane Hp1including the circuit board 50, as illustrated in FIG. 7A. This enablesa large amount of air to be supplied to the devices that generate alarge amount of heat.

As illustrated in FIG. 7A, a distance D5 between the upper inlet port 31a and the lower inlet port 31 b corresponds to a width in theupward-downward direction of the cooling fan 5. Therefore, air is drawnin from the inlet ports 31 a and 31 b and smoothly flows in the radialdirection of the cooling fan 5. In the example of the electronicapparatus 1, a lower portion (specifically, a base plate 5 d, see FIG.3) of the cooling fan 5 is attached to the edge of the lower inlet port31 b. On the other hand, an upper end (specifically, an upper end of arotor 5 e) of the cooling fan 5 is located at substantially the sameheight as the edge of the inlet port 31 a.

A distance in the upward-downward direction between the upper housingmember 30A and the lower housing member 30B at the positions of theinlet ports 31 a and 31 b, that is, the distance D5 (see FIG. 7A)between the inlet ports 31 a and 31 b, may be smaller than a distancebetween the upper housing member 30A and the lower housing member 30B atother positions. In the example of the electronic apparatus 1, the upperhousing member 30A has a recessed plate portion 32 a (see FIG. 2A) in anupper surface thereof. The recessed plate portion 32 a is recessed tothe circuit board 50 side with respect to another portion 32 c in theupper surface. (In the description here, the other portion 32 c will bereferred to as a “main plate portion.”) The upper inlet port 31 a isformed in the recessed plate portion 32 a. The heat radiating device 70,the power supply unit 60, and the like are arranged between the mainplate portion 32 c and the circuit board 50.

Similarly to the upper housing member 30A, the lower housing member 30Bhas a recessed plate portion 32 b in a lower surface thereof. Asillustrated in FIG. 2B, the recessed plate portion 32 b is recessed withrespect to another portion 32 d in the lower surface. (In thedescription here, the other portion 32 d will be referred to as a “mainplate portion.”) The lower inlet port 31 b is formed in the recessedplate portion 32 b. Fins 81 (see FIG. 8A and FIG. 8B) of the heatradiating device 80 are arranged between the main plate portion 32 d andthe circuit board 50.

Then, a distance between the upper and lower recessed plate portions 32a and 32 b corresponds to the height of the cooling fan 5. According tothis structure, it is possible to secure a sufficient distance betweenthe upper and lower main plate portions 32 c and 32 d and secure asufficient space for the heat radiating devices 70 and 80 arrangedbetween the upper and lower main plate portions 32 c and 32 d whilemaking the distance between the inlet ports 31 a and 31 b correspond tothe height of the cooling fan 5.

As illustrated in FIG. 3, the cooling fan 5 includes the rotor 5 ehaving the plurality of fins 5 a and the base plate 5 d that supportsthe rotor 5 e. The rotor 5 e is rotatable relative to the base plate 5d. As illustrated in FIG. 8B, the base plate 5 d may, for example, havea ring-shaped peripheral portion 5 f, a central portion 5 g located onthe inside of the peripheral portion 5 f, and bridges 5 i that couplethe peripheral portion 5 f and the central portion 5 g to each other.Such a base plate 5 d may be attached to the lower housing member 30B.Specifically, the ring-shaped peripheral portion 5 f may be attached tothe edge of the lower inlet port 31 b.

Because such a base plate 5 d is located on the lower side of thecooling fan 5, the air resistance of an upper portion of the cooling fan5 is smaller than the air resistance of a lower portion of the coolingfan 5. As described above, the amount of heat generation of the heatgenerating devices arranged on the upper surface of the circuit board 50is larger than the amount of heat generation of the heat generatingdevices arranged on the lower surface of the circuit board 50. That is,the cooling fan 5 is disposed such that the upper portion of the coolingfan 5 having a small air resistance corresponds to a flow passage inwhich the devices that generate a large amount of heat are arranged.

The circuit board 50 may have a curved edge 50 b (see FIG. 15) curved inthe shape of an arc as a right edge of the circuit board 50. The coolingfan 5 is disposed on the inside of the curved edge 50 b. According tothis arrangement of the circuit board 50 and the cooling fan 5, anairflow can be generated on both the upper surface and lower surface ofthe circuit board 50 while an increase in size of the electronicapparatus 1 is suppressed.

[Positional Relation between Cooling Fan and Heat Sink]

The power supply unit 60 and the heat radiating device 70 may be abreastof each other in the left-right direction. For example, as illustratedin FIG. 6B, a first heat sink 71 is disposed on the right of the powersupply unit 60. The cooling fan 5 may be disposed such that the centerline Cf of the cooling fan 5 is located on the right of a right end ofthe first heat sink 71. In the example of the electronic apparatus 1,the whole of the cooling fan 5 is located on the right of the right endof the first heat sink 71. According to this layout, the first heat sink71 and the cooling fan 5 do not interfere with each other even when asize in a front-rear direction of the first heat sink 71 is increased.It is therefore possible to suppress an increase in size in thefront-rear direction of the whole of the electronic apparatus 1 whilesecuring a sufficient size in the front-rear direction of the first heatsink 71. In the description here, the front-rear direction of the heatsink 71 is a direction in which air passes through the heat sink 71. Theleft-right direction is a direction orthogonal to the direction in whichair passes through the heat sink 71. In addition, the directionsreferred to in the present specification do not limit the attitude ofthe electronic apparatus 1 at a time of usage. Hence, for example, thepower supply unit 60 and the heat radiating device 70 may be arrangednext to each other in the front-rear direction, and the cooling fan 5and the heat sink 71 may also be arranged next to each other in thefront-rear direction. In such a case, a size in the left-right directionof the heat sink 71 can be increased.

As illustrated in FIG. 6B, the cooling fan 5 is located rearward of afront end 61 n of a power supply unit case 61 to be described later. Inaddition, the center line Cf of the cooling fan 5 is located rearward ofa front end of the first heat sink 71.

As illustrated in FIG. 6B, a second heat sink 72 (heat radiating device)may be disposed on the right of the first heat sink 71. Then, at least apart of the cooling fan 5 may be located in front of the second heatsink 72. According to this arrangement of the cooling fan 5 and thesecond heat sink 72, air flowing rearward from the cooling fan 5 canalso be used effectively.

As illustrated in FIG. 6B, a width of the second heat sink 72 in thefront-rear direction may be smaller than a width of the first heat sink71 in the front-rear direction. Then, the cooling fan 5 may be disposedin front of the second heat sink 72. According to this arrangement ofthe heat sinks 71 and 72 and the cooling fan 5, it is also possible tomake effective use of air flowing rearward from the cooling fan 5 whilesuppressing an increase in size in the front-rear direction of theelectronic apparatus 1.

As will be explained later in detail, the heat radiating device 70 has aplurality of heat pipes 73A to 73F (see FIG. 13B). The two heat sinks 71and 72 are thermally connected to each other by the plurality of heatpipes 73. In addition, the two heat sinks 71 and 72 are fixed to acommon base plate 75 (see FIG. 13A).

Incidentally, unlike the example of the electronic apparatus 1, thefirst heat sink 71 and the second heat sink 72 may not be coupled toeach other by a heat transfer section such as the heat pipes. Forexample, the second heat sink 72 may be used to cool a heat generatingpart (for example, an electronic part) different from the integratedcircuit 50 a to which the first heat sink 71 is connected. In addition,the part disposed on the right of the first heat sink 71 and in the rearof the cooling fan 5 may not be the heat sink 72. For example, a heatgenerating part (for example, an electronic part) to be cooled may bedisposed in the rear of the cooling fan 5.

[Air Flow Passages Between Housings and Exterior Panels]

The upper surface of the housing 30 is covered by the upper exteriorpanel 20A. A clearance Ua (see FIG. 20A) that allows air to flow to theupper inlet port 31 a may be formed between the upper surface of thehousing 30 and the upper exterior panel 20A. (The clearance Ua willhereinafter be referred to as an upper flow passage.) As describedabove, the upper surface of the upper housing member 30A has therecessed plate portion 32 a (see FIG. 2A) recessed with respect to themain plate portion 32 c. The recessed plate portion 32 a is, forexample, formed in a right front portion of the upper housing member30A, and the upper inlet port 31 a is formed in the recessed plateportion 32 a. For example, the upper flow passage Ua is secured betweenthe recessed plate portion 32 a and the upper exterior panel 20A.

The upper flow passage Ua may, for example, open toward the front sideand/or the right side of the electronic apparatus 1. That is, an inletport may be provided between a front edge of the upper surface of theupper housing member 30A (specifically, a front edge of the recessedplate portion 32 a) and a front edge of the upper exterior panel 20A, oran inlet port may be provided between a right edge of the upper surfaceof the upper housing member 30A (specifically, a right edge of therecessed plate portion 32 a) and a right edge of the upper exteriorpanel 20A. In the example of the electronic apparatus 1, as illustratedin FIG. 1C and FIG. 1E, there is provided an inlet port Ea whichcontinues from the upper surface of the upper housing member 30A and thefront edge of the upper exterior panel 20A to the right edge of theupper exterior panel 20A. The inlet port Ea may, for example, continuefrom a center in the left-right direction of the front edge of the upperexterior panel 20A to a rear portion of the right edge of the upperexterior panel 20A. The upper housing member 30A may have louvers 33A inthe inlet port Ea.

The lower surface of the housing 30 is covered by the lower exteriorpanel 20B. The lower surface of the housing 30 and the lower exteriorpanel 20B of the electronic apparatus 1 may have the same structure asthe above-described structure of the housing 30 and the upper exteriorpanel 20A.

That is, a clearance Ub (see FIG. 20A) that allows air to flow to thelower inlet port 31 b may be formed between the lower surface of thehousing 30 and the lower exterior panel 20B. (The clearance Ub willhereinafter be referred to as a lower flow passage Ub.) As describedabove, the lower surface of the lower housing member 30B has therecessed plate portion 32 b (see FIG. 2B) recessed with respect to themain plate portion 32 d. The recessed plate portion 32 b is, forexample, formed in a right front portion of the lower housing member30B, and the lower inlet port 31 b is formed in the recessed plateportion 32 b. For example, the lower flow passage Ub is secured betweenthe recessed plate portion 32 b and the lower exterior panel 20B.

The lower flow passage Ub may also, for example, open toward the frontside and/or the right side of the electronic apparatus 1. That is, aninlet port may be provided between a front edge of the lower surface ofthe lower housing member 30B (specifically, a front edge of the recessedplate portion 32 b) and a front edge of the lower exterior panel 20B, oran inlet port may be provided between a right edge of the lower surfaceof the lower housing member 30B (specifically, a right edge of therecessed plate portion 32 b) and a right edge of the lower exteriorpanel 20B. In the example of the electronic apparatus 1, as illustratedin FIG. 1C and FIG. 1E, there is provided an inlet port Eb whichcontinues from the lower surface of the lower housing member 30B and thefront edge of the lower exterior panel 20B to the right edge of thelower exterior panel 20B. The inlet port Eb may, for example, continuefrom a center in the left-right direction of the front edge of the lowerexterior panel 20B to a rear portion of the right edge of the lowerexterior panel 20B. The lower housing member 30B may have louvers 33B inthe inlet port Eb.

A part other than the recessed plate portion 32 a in the upper surfaceof the upper housing member 30A, that is, the main plate portion 32 c,and the upper exterior panel 20A are in proximity to each other. Themain plate portion 32 c and the upper exterior panel 20A may be incontact with each other, or a clearance having a smaller width in theupward-downward direction than the upper flow passage Ua may be formedbetween the main plate portion 32 c and the upper exterior panel 20A.

The airflows formed by driving the cooling fan 5 are discharged rearwardfrom an exhaust port M (see FIG. 1G and FIG. 6A) formed in the backsurface of the housing 30. Louvers 33C and 33D may be formed in theexhaust port M. As illustrated in FIG. 2A, the main plate portion 32 cmay have a part 32 e located on the rear side of the recessed plateportion 32 a. According to this structure, the main plate portion 32 ccan prevent the air exhausted rearward from the exhaust port M fromflowing toward the inlet port 31 a again.

A part other than the recessed plate portion 32 b in the lower surfaceof the lower housing member 30B, that is, the main plate portion 32 d,and the lower exterior panel 20B are in proximity to each other. Themain plate portion 32 d and the lower exterior panel 20B may be incontact with each other, or a clearance having a smaller width in theupward-downward direction than the lower flow passage Ub may be formedbetween the main plate portion 32 d and the lower exterior panel 20B. Asillustrated in FIG. 2B, the main plate portion 32 d may have a part 32 flocated on the rear side of the recessed plate portion 32 b. Accordingto this structure, the main plate portion 32 d can prevent the airexhausted rearward from the exhaust port M from flowing toward the inletport 31 b again.

The external surface of the electronic apparatus 1 is curved such that awidth in the upward-downward direction of the electronic apparatus 1 isincreased in a right front portion of the electronic apparatus 1 inwhich the inlet ports 31 a and 31 b are formed. In other words, theexterior panels 20A and 20B are curved such that a distance between theexterior panels 20A and 20B is increased in the right front portion ofthe electronic apparatus 1. This external shape of the electronicapparatus 1 makes it easy to secure sufficient widths in theupward-downward direction of the above-described flow passages Ua andUb. The curves of the exterior panels 20A and 20B will be explainedlater in detail.

Incidentally, the positions of the inlet ports 31 a and 31 b formed inthe housing 30 and the positions of the inlet ports Ea and Eb formedbetween the housing 30 and the exterior panels 20A and 20B are notlimited to the example illustrated in the electronic apparatus 1. Forexample, the inlet ports 31 a and 31 b may be formed in a left portionof the housing 30. In addition, the inlet ports 31 a and 31 b may beformed in only either the upper surface or the lower surface of thehousing 30. The positions of the inlet ports Ea and Eb may be changed asappropriate according to the positions of the inlet ports 31 a and 31 b.

As illustrated in FIG. 6A, the electronic apparatus 1 may have a fanguard 38A that is attached to the edge of the inlet port 31 a and coversthe upper side of the cooling fan 5. Similarly, the electronic apparatus1 may have a fan guard 38B that is attached to the edge of the inletport 31 b and covers the lower side of the cooling fan 5.

As illustrated in FIG. 10A, the fan guard 38A includes a plurality ofrings 38 a, a central portion 38 b located in the center of theplurality of ring 38 a, and a plurality of spokes 38 c extending fromthe outside rings 38 a to the central portion 38 b. In the example ofthe electronic apparatus 1, the cooling fan 5 rotates in a clockwisedirection as viewed in plan. The spokes 38 c are inclined so as toconform to the direction of rotation of the cooling fan 5. Specifically,the spokes 38 c are inclined with respect to a radial direction so as toadvance in the clockwise direction toward the center Cf. According tothis structure, the spokes 38 c can avoid becoming an air resistance.

As illustrated in FIG. 10B, the positions of the plurality of rings 38 aand the position of the central portion 38 b are raised toward thecenter Cf. In addition, the spokes 38 c extend obliquely so as to beraised toward the center Cf. This can increase the area of openingsformed between the rings 38 a and the spokes 38 c.

As described above, the spokes 38 c extend obliquely so as to be raisedtoward the center Cf. On the other hand, each of the rings 38 a may havea cross section along a plane perpendicular to the rotational centerline Cf of the cooling fan 5 (plane Hp5 in FIG. 10B). This can increasethe area of the openings formed between the rings 38 a and the spokes 38c. The upper exterior panel 20A is disposed on the upper side of the fanguard 38A. As described above, the upper exterior panel 20A is curved.The fan guard 38A may be curved in conformity with the curve of theupper exterior panel 20A.

The fan guard 38B that covers the lower side of the cooling fan 5 mayhave the same structure as the upper fan guard 38A. That is, the fanguard 38B may be obtained by inverting the upper surface and lowersurface of the fan guard 38A.

[Power Supply Unit]

As illustrated in FIG. 7B, the power supply unit 60 includes a powersupply circuit 62 and a power supply unit case 61 that houses the powersupply circuit 62. The power supply unit case 61 has a wall portion 61 alocated in front of the first heat sink 71. A plurality of air intakeholes 61 b may be formed in the wall portion 61 a. (The wall portion 61a will hereinafter be referred to as an “intake air wall.”) Asillustrated in FIG. 6B, the heat sinks 71 and 72 have a plurality offins 71 a and 72 a abreast of one another in the left-right direction.Therefore, air passes through the heat sinks 71 and 72 in the front-reardirection. The intake air wall 61 a is disposed obliquely with respectto the front-rear direction and the left-right direction. The externalsurface of the intake air wall 61 a faces the first heat sink 71. Here,the “external surface of the intake air wall 61 a faces the first heatsink 71” means that a straight line extending from the external surfaceand perpendicular to the external surface intersects the first heat sink71. The cooling fan 5 is disposed so as to send air to the intake airwall 61 a. In the example of the electronic apparatus 1, the cooling fan5 is separated rightward from the external surface of the intake airwall 61 a. An airflow from the cooling fan 5 to the intake air wall 61 ais formed by flow passage walls 34A and 34B to be described later.

According to the shape and disposition of the power supply unit case 61,as illustrated in FIG. 6B, a part of the air reaching the intake airwall 61 a passes through the air intake holes 61 b and enters the insideof the power supply unit case 61. In addition, another part of the airreaching the intake air wall 61 a moves to the first heat sink 71 whileguided by the intake air wall 61 a. That is, the intake air wall 61 amakes it possible to secure an airflow to be supplied to the first heatsink 71, and cool the power supply unit 60 by a cold air (air not warmedby another heat generating device or heat radiating device) at the sametime. When the power supply unit 60 can be cooled by the cold air, aclearance between circuit parts 62 a and 62 b included in the powersupply circuit 62 (for example, a transformer and a capacitor) can bereduced, so that the power supply unit 60 can be miniaturized.

The power supply unit case 61 includes a case rear portion 61 c locatedon the left side of the first heat sink 71 and a case front portion 61 dextending frontward beyond the position of the front end of the firstheat sink 71. In the example of the electronic apparatus 1, the intakeair wall 61 a is a right side wall of the case front portion 61 d andextends obliquely frontward and rightward from a right side wall 61 f ofthe case rear portion 61 c. On the other hand, a left side wall 61 e ofthe power supply unit case 61 extends frontward in a straight mannerfrom the case rear portion 61 c to the case front portion 61 d. Hence, awidth in the left-right direction of the case front portion 61 dincreases gradually toward the front.

As illustrated in FIG. 11B, the air intake holes 61 b may be formedobliquely with respect to the intake air wall 61 a. That is, a centerline Ch1 of an air intake hole 61 b may be inclined with respect to theintake air wall 61 a. For example, the center line Ch1 of the air intakehole 61 b may be along the left-right direction. This makes it easy forthe air discharged from the cooling fan 5 to pass through the intake airwall 61 a. Incidentally, the structure of the air intake hole 61 b isnot limited to the example of the electronic apparatus 1. The centerline Ch1 of the air intake hole 61 b may be inclined with respect toboth the left-right direction and the front-rear direction in conformitywith the direction of the airflow. For example, the center line Ch1 mayextend obliquely frontward and rightward from the intake air wall 61 a.

As illustrated in FIG. 11A and FIG. 11B, air intake holes 61 m may alsobe formed in the right side wall 61 f of the case rear portion 61 c. Insuch a case, a direction in which the air intake holes 61 m penetratethe right side wall 61 f, that is, the direction of a center line Ch2 ofan air intake hole 61 m, may be the same as that of the air intake holes61 b in the intake air wall 61 a. This can facilitate formation of thetwo kinds of air intake holes 61 b and 61 m.

As illustrated in FIG. 7B, a part of the power supply circuit 62 may bedisposed in a space provided within the case front portion 61 d andsecured by the inclination of the intake air wall 61 a, that is, a spaceSf (see FIG. 6B) formed on the inside of the intake air wall 61 a.Circuit parts 62 b included in the power supply circuit 62 are housed inthis space and are located in front of the first heat sink 71. Accordingto such a layout, it is possible to make effective use of the volume ofthe power supply unit case 61.

The circuit parts 62 b arranged in the space formed on the inside of theintake air wall 61 a may have a smaller size than other parts 62 a. Thiscan facilitate an airflow within the power supply unit case 61.

A plurality of exhaust holes 61 g and 61 h may be formed in the caserear portion 61 c. More specifically, as illustrated in FIG. 7C, theplurality of exhaust holes 61 g may be formed in a rear wall 61 i of thecase rear portion 61 c, and the plurality of exhaust holes 61 h may beformed in a rear portion 61 k of an upper wall 61 j of the power supplyunit case 61. In the example of the electronic apparatus 1, the rearportion 61 k of the upper wall 61 j is recessed with respect to a frontportion of the upper wall 61 j. Due to this recess, an air flow passageSe is secured between the upper housing member 30A and the rear portion61 k.

The positions of the exhaust holes 61 g and 61 h are not limited to theexample illustrated in the electronic apparatus 1. For example, theexhaust holes 61 h formed in the upper wall 61 j may not be present. Aplurality of exhaust holes may be formed in a rearmost portion of theleft side wall 61 e.

[Flow Passage Walls Defining Air Flow Passage]

The heat radiating device 70 includes the first heat sink 71 and thesecond heat sink 72 abreast of each other in the left-right direction.The cooling fan 5 is located in front of the second heat sink 72. Asillustrated in FIG. 4 and FIG. 6B, the upper housing member 30A may havea flow passage wall 34A that defines the flow passage of the airflowsent out from the cooling fan 5 and guides the airflow toward the firstheat sink 71. The flow passage wall 34A has a part curved along theouter circumference of the cooling fan 5. In the example of theelectronic apparatus 1, the whole of the flow passage wall 34A iscurved.

As illustrated in FIG. 6B, as a distance from a starting point 34 a ofthe flow passage wall 34A increases in the extending direction of theflow passage wall 34A, a distance from the cooling fan 5 to the flowpassage wall 34A (distance in the radial direction of the cooling fan 5)increases. The flow passage wall 34A extends from the periphery of thecooling fan 5 toward the intake air wall 61 a of the power supply unitcase 61. The intake air wall 61 a is located on an extension of an end34 b of the flow passage wall 34A. Such a flow passage wall 34A enablesthe air from the cooling fan 5 to be sent to the intake air wall 61 asmoothly.

The intake air wall 61 a may be curved similarly to the flow passagewall 34A. For example, the flow passage wall 34A is formed along a curvedefined by a predetermined function. The intake air wall 61 a may bedisposed along the same curve. For example, the flow passage wall 34A isformed along a clothoid curve having the rotational center line Cf ofthe cooling fan 5 as an origin. In such a case, the intake air wall 61 amay also be curved along the same clothoid curve. Thus, a smooth airflowis formed from the cooling fan 5 to the intake air wall 61 a and thefirst heat sink 71. Incidentally, the curve on which the curving of theflow passage wall 34A and the intake air wall 61 a is based may be, forexample, an involute curve, a logarithmic spiral, a Nielsen spiral, orthe like instead of the clothoid curve.

The flow passage wall 34A surrounds the periphery of the cooling fan 5located on the outside of the outer edge of the circuit board 50. Theflow passage wall 34A extends downward from a part forming the uppersurface of the apparatus main body 10 in the upper housing member 30A(the part is the recessed plate portion 32 a in the example of theelectronic apparatus 1). A lower edge of the flow passage wall 34A mayreach the lower housing member 30B.

In the example of the electronic apparatus 1, as illustrated in FIG. 4and FIG. 8B, a flow passage wall 34B that projects upward is formed onthe lower housing member 30B. Similarly to the flow passage wall 34A,the flow passage wall 34B defines the flow passage of the airflow sentout from the cooling fan 5. The flow passage wall 34B has a part curvedalong the periphery of the cooling fan 5. In the example of theelectronic apparatus 1, similarly to the flow passage wall 34A, thewhole of the flow passage wall 34B is curved.

As illustrated in FIG. 7B, the lower edge of the flow passage wall 34Aof the upper housing member 30A is connected to the flow passage wall34B of the lower housing member 30B in the upward-downward direction.The flow passage walls 34A and 34B are connected to each other to formone wall extending along the periphery of the cooling fan 5. In theexample of the electronic apparatus 1, the flow passage walls 34A and34B function as a wall on the front side of the cooling fan 5.

The structure of the flow passage walls 34A and 34B is not limited tothe example of the electronic apparatus 1. For example, only either theupper housing member 30A or the lower housing member 30B may have a flowpassage wall formed thereon. Then, the flow passage wall formed on theone housing member may extend upward or downward until reaching theother housing member.

As illustrated in FIG. 4, the electronic apparatus 1 has a frontexterior panel 35 that covers the flow passage walls 34A and 34B as apart of exterior members. The front exterior panel 35 is located on thefront side and right side of the curved flow passage walls 34A and 34Band covers the whole of the flow passage walls 34A and 34B. Due to thepresence of the front exterior panel 35, a degree of freedom can besecured for the shape of the flow passage walls 34A and 34B. A circuitboard mounted with switches operated by the power button 2 a and theoptical disk ejecting button 2 b may be attached to the front exteriorpanel 35, or a circuit board mounted with the connectors 3 a and 3 b maybe attached to the front exterior panel 35.

[Air Flow Passage on Lower Side of Circuit Board]

As described above, the power supply unit 60 and the heat radiatingdevice 70 are arranged on the upper surface of the circuit board 50, andthe power supply unit 60 and the heat radiating device 70 are abreast ofeach other in the left-right direction. The air sent out from thecooling fan 5 passes through the heat radiating device 70 and the powersupply unit case 61. Hence, an airflow is formed in the whole of a spacebetween the circuit board 50 and the upper housing member 30A. On theother hand, the lower side of the circuit board 50 may be provided witha member that reduces the width of an air flow passage between thecircuit board 50 and the lower housing member 30B. Then, the width ofthe air flow passage between the lower surface of the circuit board 50and the lower housing member 30B may be narrower than the width of theair flow passage between the upper surface of the circuit board 50 andthe upper housing member 30A. This facilitates securing of a speed of anairflow formed on the lower side of the circuit board 50.

In the example of the electronic apparatus 1, the optical disk drive 6is disposed on the lower side of the circuit board 50. The optical diskdrive 6 reduces the width of the air flow passage between the circuitboard 50 and the lower housing member 30B.

As illustrated in FIG. 8B, the optical disk drive 6 is separatedleftward from the cooling fan 5 as viewed in plan of the electronicapparatus 1. The optical disk drive 6 has a disk drive case 6 a. Aspindle motor (not illustrated) that rotates an optical disk, a pickupmodule (not illustrated), and the like are arranged within the diskdrive case 6 a.

As illustrated in FIG. 8B, an air flow passage Sb from the cooling fan 5to the exhaust port M (see FIG. 8A) is formed between the cooling fan 5and the disk drive case 6 a. The disk drive case 6 a limits the air flowpassage Sb to a right region on the circuit board 50. The disk drivecase 6 a has a right side wall 6 b that faces the cooling fan 5 and thatextends in the front-rear direction at a position separated leftwardfrom the cooling fan 5. The air flow passage Sb is formed between theright side wall 6 b and the cooling fan 5. The plurality of fins 81included in the heat radiating device 80 are arranged at a midpoint ofthe air flow passage Sb.

A wall defining the air flow passage Sb may be formed on the lowerhousing member 30B. As illustrated in FIG. 4 and FIG. 8B, for example,the lower housing member 30B may have a flow passage wall 34 c thatextends from the periphery of the cooling fan 5 toward the heatradiating device 80. In the example of the electronic apparatus 1, theflow passage wall 34 c extends from a starting point of theabove-described flow passage wall 34B curved on the periphery of thecooling fan 5, toward the heat radiating device 80.

Incidentally, the electronic apparatus 1 may not have the optical diskdrive 6. In such a case, a wall may limit the air flow passage Sb. Awall portion formed on the lower housing member 30B may be used as amember that reduces the width of the air flow passage between thecircuit board 50 and the lower housing member 30B as compared with theair flow passage between the circuit board 50 and the upper housingmember 30A.

As illustrated in FIG. 4, an opening 30 c corresponding in size andshape to the disk drive case 6 a is formed in the lower housing member30B. The lower surface of the disk drive case 6 a may be exposeddownward from the opening 30 c. According to this structure, the widthin the upward-downward direction of the electronic apparatus 1 can bereduced by the thickness of the lower housing member 30B.

[Dust Collecting Chamber]

As illustrated in FIG. 6B, a dust collecting chamber Ds may be providedto the flow passage wall 34A. The dust collecting chamber Ds capturesdust included in the airflow formed on the upper side of the circuitboard 50 and collects the captured dust. According to this structure, itis possible to reduce an amount of dust entering devices arrangeddownstream of the dust collecting chamber Ds, the devices being thefirst heat sink 71, the power supply unit 60, and the like.

The dust collecting chamber Ds is defined by a dust collecting chamberwall 34C (see FIG. 5). The dust collecting chamber wall 34C is in a boxshape opening in two directions to be described later. The dustcollecting chamber wall 34C is, for example, formed integrally with theupper housing member 30A. This makes it possible to secure the dustcollecting chamber Ds without increasing the number of parts. Inaddition, because the upper housing member 30A is a member that coversthe whole of the internal devices, a degree of freedom of the positionof the dust collecting chamber Ds can be secured when the dustcollecting chamber wall 34C is formed integrally with the upper housingmember 30A.

As viewed in plan of the electronic apparatus 1, the cooling fan 5rotates in the clockwise direction about the rotational center line Cf.In the example of the electronic apparatus 1, the flow passage wall 34Aextends in the clockwise direction from the starting point 34 a of theflow passage wall 34A along the periphery of the cooling fan 5. Thewhole of the flow passage wall 34A is curved. The dust collectingchamber Ds may be provided to the thus curved flow passage wall 34A.More specifically, the dust collecting chamber Ds may be located at anend portion of the flow passage wall 34A. The position of the dustcollecting chamber Ds is not limited to the example of the electronicapparatus 1. The dust collecting chamber Ds may be provided at amidpoint of the flow passage wall 34A.

Two devices each of which is a heat generating device or a heatradiating device may be disposed downstream of the air flow passageformed by the flow passage wall 34A. The dust collecting chamber Ds maybe located upstream of the two devices. In the example of the electronicapparatus 1, the power supply unit 60 and the first heat sink 71 arelocated downstream of the air flow passage defined by the flow passagewall 34A. The dust collecting chamber Ds is located upstream of thepower supply unit 60 and the first heat sink 71. In such a manner,sending dust to the two devices can be prevented by the one dustcollecting chamber Ds. In the example of the electronic apparatus 1, thedust collecting chamber Ds is located between the intake air wall 61 aof the power supply unit case 61 and the flow passage wall 34A.

As illustrated in FIG. 12, the dust collecting chamber Ds has a firstopening A1 that opens in a direction along the circuit board 50 towardan air flow passage Sa defined by the flow passage wall 34A and theintake air wall 61 a. Dust included in air flowing through the air flowpassage Sa is captured from the first opening A1 into the dustcollecting chamber Ds. The dust collecting chamber Ds also has a secondopening A2 that opens to the outside of the air flow passage Sa in adirection intersecting the circuit board 50. According to this structureof the dust collecting chamber Ds, the dust can be collected in the dustcollecting chamber Ds, and the collected dust can be discharged throughthe second opening A2 by relatively simple work.

The direction in which the second opening A2 opens is, for example, adirection orthogonal to the circuit board 50. The second opening A2opens to the outside of the housing 30, more specifically, to the upperside of the upper housing member 30A. The upper exterior panel 20Acovers the second opening A2 and prevents exposure of the second openingA2 to the outside. A user can expose the second opening A2 by removingthe upper exterior panel 20A from the upper housing member 30A andextract the dust collected in the dust collecting chamber Ds. Forexample, the dust collected in the dust collecting chamber Ds can besucked by a vacuum cleaner. In addition, because the upper exteriorpanel 20A is used as a member that covers the second opening A2, anincrease in the number of parts can be suppressed.

The dust collecting chamber wall 34C defining the dust collectingchamber Ds has a side wall 34 e (see FIG. 12) that extends downward froman edge of the second opening A2. As illustrated in FIG. 6B, a part 34 fof the side wall 34 e is located between the flow passage wall 34A andthe intake air wall 61 a and faces the air flow passage Sa. (The part 34f will hereinafter be referred to as an “inner wall.”) The inner wall 34f may be curved in conformity with the flow passage wall 34A. Forexample, the inner wall 34 f may be formed along the curve of a functiondefining the curve of the flow passage wall 34A (for example, a clothoidcurve). Further, in another example, as indicated by a broken line inFIG. 6B, the inner wall 34 f may extend to the inside of the curve ofthe function defining the curve of the flow passage wall 34A (forexample, the clothoid curve). This can enlarge the first opening A1 andincrease an amount of air entering the dust collecting chamber Ds.

As illustrated in FIG. 12, the dust collecting chamber wall 34C may havea bottom portion 34 g located at a lower edge of the side wall 34 e. Thedust captured in the dust collecting chamber Ds is collected on thebottom portion 34 g. The bottom portion 34 g may have a bank portion 34h along the edge of the first opening A1. According to this, it ispossible to prevent the dust collected on the bottom portion 34 g fromreturning to the air flow passage Sa. The bottom portion 34 g may beattached to the circuit board 50 by a boss 34 h and a screw 59.

Incidentally, when the upper exterior panel 20A is attached to the upperhousing member 30A, a clearance may be formed between the edge of thesecond opening A2 and the upper exterior panel 20A. This facilitatesformation of an airflow that enters the dust collecting chamber Ds fromthe first opening A1 and that is discharged to the outside from the dustcollecting chamber Ds through the second opening A2.

Incidentally, the structure of the dust collecting chamber Ds is notlimited to the example of the electronic apparatus 1. For example,instead of using the upper exterior panel 20A as a cover that covers thesecond opening A2, a dedicated cover (lid) that covers the secondopening A2 may be provided to the second opening A2. In another example,the dust collecting chamber Ds may be formed in the power supply unitcase 61 instead of being formed in the upper housing member 30A.

As illustrated in FIG. 27, a third opening A3 may be formed in the upperhousing member 30A in addition to the second opening A2 of the dustcollecting chamber Ds. In an example illustrated in FIG. 27, the upperhousing member 30A covers a heat radiating device 170 (see FIGS. 26A to26C) to be described later as a modification of the heat radiatingdevice 70. Fins 171 a of a heat sink 171A on a front side are inclinedwith respect to the front-rear direction and the left-right direction.Therefore, a substantially triangular space is generated between a fin171 c located at an end portion in the heat sink 171A and the right wallportion 61 f of the power supply unit case 61. The third opening A3 islocated directly above this space. According to this structure, dustcollected in the space between the heat sink 171A on the front side andthe right wall portion 61 f of the power supply unit case 61 can beextracted through the third opening A3. For example, the dust collectedin this space can be sucked by a vacuum cleaner.

[Heat Radiating Device on Upper Side]

As illustrated in FIG. 13B, the heat radiating device 70 has theplurality of heat pipes 73A to 73F in addition to the heat sinks 71 and72. In the example of the electronic apparatus 1, the heat radiatingdevice 70 has six heat pipes 73A to 73F. However, the number of heatpipes may be two or three, or may be larger than six. In the followingdescription, in cases where the plurality of heat pipes 73A to 73F arenot distinguished from each other, a reference numeral 73 is used forthe plurality of heat pipes 73A to 73F. In addition, as illustrated inFIG. 13A, the heat radiating device 70 may have the base plate 75. Theheat sinks 71 and 72 are fixed to the upper side of the base plate 75.The fins 71 a and 72 a of the heat sinks 71 and 72 are, for example,fixed to the base plate 75 by solder.

As illustrated in FIG. 14A, each heat pipe 73 has a heat receivingportion 73 a thermally connected to the integrated circuit 50 a mountedon the circuit board 50. Here, the “heat receiving portion 73 athermally connected to the integrated circuit 50 a” means that the heatreceiving portion 73 a and the integrated circuit 50 a are in directcontact with each other or connected to each other via a metallic parthaving a high thermal conductivity such as copper or aluminum such thatthe heat of the integrated circuit 50 a is transmitted to the heatreceiving portion 73 a. In the example of the electronic apparatus 1,the heat receiving portion 73 a is a part located directly above theintegrated circuit 50 a. The heat radiating device 70 may have a heattransfer member 74 disposed between the heat pipe 73 and the integratedcircuit 50 a. The heat receiving portion 73 a may be connected to theintegrated circuit 50 a via the heat transfer member 74.

As illustrated in FIG. 14A, the heat receiving portions 73 a of theplurality of heat pipes 73 are abreast of each other in the left-rightdirection and may be in contact with the heat receiving portions 73 a ofadjacent heat pipes 73. The cross section of the heat receiving portions73 a is substantially rectangular, and the heat receiving portions 73 ahave an upper surface, a lower surface, a left side surface, and a rightside surface. Those side surfaces of the heat receiving portions 73 aare in contact with those of adjacent heat receiving portions 73 a. Twoadjacent heat receiving portions 73 a may be in direct contact with eachother or may be in contact with each other via a layer of a thermallyconductive grease or the like.

As illustrated in FIG. 14A, each heat receiving portion 73 a has a widthW1 in the upward-downward direction and has a width W2 in the left-rightdirection. The width W1 in the upward-downward direction is larger thanthe width W2 in the left-right direction. According to this structure,it becomes easy to increase the number of heat pipes 73. As a result, itbecomes easy to increase the size of the heat sinks 71 and 72 to whichthe heat of the integrated circuit 50 a is transmitted through the heatpipes 73. In the example of the electronic apparatus 1, the width W2 inthe left-right direction is smaller than ¾ of the width W1 in theupward-downward direction. The width W2 in the left-right direction maybe smaller than ⅔ of the width W1 in the upward-downward direction. Thewidth W2 in the left-right direction may be larger than ½ of the widthW1 in the upward-downward direction.

As illustrated in FIG. 14A, a total width Wa (width in the left-rightdirection) of the heat receiving portions 73 a of the plurality of heatpipes 73 may correspond to a width in the left-right direction of theintegrated circuit 50 a. More specifically, a difference in widthbetween the total width Wa and the integrated circuit 50 a may besmaller than the thickness of one heat pipe 73 (the width W2 in theleft-right direction of a heat receiving portion 73 a). In the exampleof the electronic apparatus 1, this difference is smaller than half ofthe thickness of one heat pipe 73. Because the total width Wa thuscorresponds to the width of the integrated circuit 50 a, all of the heatpipes 73 can be made to function effectively.

As illustrated in FIG. 14A, the heat transfer member 74 has two sideportions 74 b separated from each other in the left-right direction anda groove 74 a formed between the two side portions 74 b. The width ofthe groove 74 a in the left-right direction corresponds to the totalwidth Wa of the heat receiving portions 73 a of the plurality of heatpipes 73. The heat receiving portions 73 a of all of the heat pipes 73are arranged within the groove 74 a. The side surfaces of heat receivingportions 73 a located at a respective right and left ends may be incontact with the inner surface (side portion 74 b) of the groove 74 a ofthe heat transfer member 74. The depth of the groove 74 a corresponds tothe width W1 in the upward-downward direction of the heat receivingportions 73 a. Therefore, the height of the upper surfaces of the heatreceiving portions 73 a and the height of the upper surfaces of the sideportions 74 b substantially coincide with each other. Lower edges of thefins 71 a included in the heat sink 71 are fixed to the upper surfacesof the side portions 74 b. The fins 71 a are fixed to the upper surfacesof the side portions 74 b by solder, for example. According to the sideportions 74 b, heat can also be transmitted to the fins 71 a located onthe right side and left side of the heat receiving portions 73 a.

The width in the upward-downward direction and the width in theleft-right direction of the heat pipes 73 may be changed in theextending direction of the heat pipes 73. Then, the heat pipes 73 mayinclude a part whose width in the upward-downward direction is smallerthan the width in the left-right direction in contrast to the heatreceiving portions 73 a. This can facilitate bending of the heat pipes73 and improve conductivity of heat from the heat pipes 73 to the heatsinks 71 and 72. In the example of the electronic apparatus 1, the widthin the upward-downward direction of all of the heat pipes 73 changes inthe extending direction of the heat pipes 73. Unlike the example of theelectronic apparatus 1, the width in the upward-downward direction ofonly a part of the heat pipes 73 may be changed in the extendingdirection of the heat pipes 73.

As illustrated in FIG. 13B, each of the heat pipes 73 has parts 73 b and73 c in contact with the heat sinks 71 and 72 at positions separatedfrom the heat receiving portion 73 a in the extending direction of theheat pipe 73. In the following, the part 73 b in contact with the firstheat sink 71 will be referred to as a first heat radiating portion, andthe part 73 c in contact with the second heat sink 72 will be referredto as a second heat radiating portion. For example, as illustrated inFIG. 14B, the heat pipes 73C and 73D have a second heat radiatingportion 73 c that extends rightward on the lower side of the second heatsink 72 and is connected to the lower edge of each fin 72 a. The heatpipes 73E and 73F have a second heat radiating portion 73 c that extendsrightward on the upper side of the second heat sink 72 and is connectedto the upper edge of each fin 72 a. In addition, as illustrated in FIG.13B, the heat pipes 73A to 73F have a first heat radiating portion 73 bin contact with the lower edge of the first heat sink 71.

A width possessed by the second heat radiating portions 73 c in adirection orthogonal to the extending direction of the second heatradiating portions 73 c and the upward-downward direction may be largerthan a width possessed by the second heat radiating portions 73 c in theupward-downward direction. In the example of the electronic apparatus 1,as illustrated in FIG. 14B, the second heat radiating portions 73 c havea width W3 in the upward-downward direction and have a width W4 in thefront-rear direction. Then, the width W4 in the front-rear direction islarger than the width W3 in the upward-downward direction. This makes itpossible to transmit heat from the second heat radiating portions 73 cto the second heat sink 72 efficiently.

Similarly, a width possessed by the first heat radiating portions 73 bin a direction orthogonal to the extending direction of the first heatradiating portions 73 b and the upward-downward direction may be largerthan a width possessed by the first heat radiating portions 73 b in theupward-downward direction. This can improve thermal conductivity fromthe first heat radiating portions 73 b to the first heat sink 71.

In each of the heat pipes 73, the width W1 in the upward-downwarddirection of the heat receiving portion 73 a is larger than the width inthe upward-downward direction of the heat radiating portions 73 b and 73c (W1>W3). On the other hand, the width of the heat radiating portions73 b and 73 c in a direction orthogonal to the extending direction ofthe heat radiating portions 73 b and 73 c and the upward-downwarddirection (for example, the width W4 of the second heat radiatingportions 73 c) is larger than the width of the heat receiving portions73 a in a direction orthogonal to the extending direction of the heatreceiving portions 73 a and the upward-downward direction (that is, thewidth W2) (W4>W2). According to this structure, it is possible to avoida change in outer circumferential length of the cross section of eachheat pipe 73.

Incidentally, the heat radiating portions 73 b and 73 c may not bearranged on the upper side or lower side of the heat sinks 71 and 72.For example, the second heat radiating portions 73 c may extend in theleft-right direction on the front side or the rear side of the secondheat sink 72. In such a case, the width in the upward-downward directionof the second heat radiating portions 73 c may be larger than the widthin the front-rear direction. Further, in another example, holes thatpenetrate the respective fins 72 a of the second heat sink 72 in theleft-right direction may be formed in the fins 72 a. Then, the secondheat radiating portions 73 c may be inserted into the through holes. Insuch a case, the upper surfaces and/or lower surfaces of the second heatradiating portions 73 c may be in contact with edges of the throughholes of the heat sink 72. Then, the width in the front-rear directionof the second heat radiating portions 73 c may be larger than the widthin the upward-downward direction.

The radius of curvature of an angular portion 73 d of a heat receivingportion 73 a (see FIG. 14A) may be smaller than the radius of curvatureof an angular portion or a side portion of the heat radiating portions73 b and 73 c (for example, a side portion 73 e illustrated in FIG.14B). Thus, the cross section of the heat receiving portion 73 aapproaches a rectangle, so that the plurality of heat pipes 73 can bearranged on the upper side of the integrated circuit 50 a efficiently.

As illustrated in FIG. 14C, each of the heat pipes 73 has anintermediate portion 73 h located between the integrated circuit 50 amounted on the circuit board 50 and the first heat sink 71. Theintermediate portion 73 h is a part located between the heat receivingportion 73 a and the first heat radiating portion 73 b. As viewed inplan of the heat radiating device 70, the intermediate portions 73 h ofthe plurality of heat pipes 73 spread in a direction orthogonal to theextending direction of each heat receiving portion 73 a (left-rightdirection in the example of the electronic apparatus 1) (see FIG. 13B).

As illustrated in FIG. 14C, an upper surface 73 i of the intermediateportion 73 h is connected to the lower edge of a fin 71 a of the firstheat sink 71. The upper surface 73 i is parallel with the circuit board50 and the lower edge of the fin 71 a. On the other hand, a lowersurface 73 j of the intermediate portion 73 h may be inclined such thata width W7 in the upward-downward direction of the intermediate portion73 h is gradually decreased with an increase in distance from the heatreceiving portion 73 a. This can improve a degree of freedom of thelayout of the electronic parts 50 c below the intermediate portion 73 h.Incidentally, the lower surface 73 j of the intermediate portion 73 hmay not necessarily be inclined. A plurality of steps may be formed inthe lower surface 73 j such that the width W7 in the upward-downwarddirection of the intermediate portion 73 h is gradually decreased.

The base plate 75 has a bottom portion 75 c located under theintermediate portion 73 h. A plurality of steps may be formed in thebottom portion 75 c to bias the lower surface 73 j of the intermediateportion 73 h to the heat sink 71 side.

As described above, the second heat radiating portions 73 c of the heatpipes 73E and 73F are arranged along the upper side of the second heatsink 72. Therefore, as illustrated in FIG. 13A, the two heat pipes 73Eand 73F may have a curved portion 73 g bending upward from the lowerside of the first heat sink 71 to the upper side of the second heat sink72.

As illustrated in FIG. 9, the curved portion 73 g has a width W5 in theupward-downward direction. In addition, the curved portion 73 g has awidth W6 in a direction orthogonal to the extending direction of thecurved portion 73 g and the upward-downward direction (front-reardirection in the example illustrated in FIG. 9). Then, the width W6 maybe larger than the width W5 in the upward-downward direction. Accordingto this structure of the heat pipes 73E and 73F, the heat pipes 73E and73F are bent upward easily.

Incidentally, the direction in which the curved portion 73 g is bent isnot limited to the upward-downward direction. For example, in a casewhere the second heat radiating portion 73 c is disposed on the frontside or the rear side of the second heat sink 72, the curved portion 73g may be bent to the front side or the rear side. In such a case, thewidth of the curved portion 73 g in the upward-downward direction may belarger than the width of the curved portion 73 g in the front-reardirection.

FIGS. 26A to 26C is a diagram illustrating the heat radiating device 170as a modification of the heat radiating device 70. FIG. 27 is a planview of the apparatus main body 10 having the heat radiating device 170.In FIG. 27, the heat radiating device 170 is covered by the upperhousing member 30A.

In the heat radiating device 170, the first heat sink 71 illustrated inFIG. 13A and the like is separated into two heat sinks 171A and 171B(two fin blocks) in a direction along the airflow (front-rear directionin the example of the electronic apparatus 1), as illustrated in FIG.26A. The heat sinks 171A and 171B are fixed to the common base plate 75.In addition, the heat sinks 171A and 171B are coupled to each other bycommon heat pipes 73 having heat receiving portions 73 a thermallyconnected to the integrated circuit 50 a mounted on the circuit board50. The heat sink 171A on the front side is located leftward of thecenter line Cf of the cooling fan 5, and a line along the left-rightdirection passes through the center line Cf and the heat sink 171A (seeFIG. 27). The heat transfer member 74 and the heat receiving portions 73a of the heat pipes 73 are fixed to the heat sink 171A on the front side(fin block on the front side). The heat sink 171A on the front side isconnected to the integrated circuit 50 a through the heat transfermember 74 and the heat receiving portions 73 a. The heat sink 171B onthe rear side (fin block on the rear side) is located in the rear of theheat sink 171A. The heat radiating portions 73 c of the plurality ofheat pipes 73 are fixed to the heat sink 171B on the rear side. Thesecond heat sink 72 and the heat sink 171B on the rear side are abreastof each other in the left-right direction.

In the following description, the heat sink 171A on the front side willbe referred to as a first front heat sink, the heat sink 171B will bereferred to as a first rear heat sink, and the heat sink 72 will bereferred to as a second heat sink as in the example of FIG. 13A.

As illustrated in FIG. 26A, the front edge of the first rear heat sink171B is separated rearward from the rear edge of the first front heatsink 171A, and a gap Gn is secured between the front edge of the firstrear heat sink 171B and the rear edge of the first front heat sink 171A.According to this structure, air that has passed through the rear edgeof the first front heat sink 171A is mixed in the gap Gn (that is, theflow of the air is disturbed in the gap Gn), and thereafter, the airenters the first rear heat sink 171B. Therefore, the air into which heatis to be radiated is distributed to the whole of the first rear heatsink 171B easily. As a result, it is possible to make effective use ofthe first rear heat sink 171B and thus improve cooling performance.

As illustrated in FIG. 26A, in the heat radiating device 170, the heatsinks 171A and 171B have a plurality of fins 171 a and 171 b,respectively, abreast of one another in the left-right direction. Thefins 171 a included in the first front heat sink 171A are inclined withrespect to both the front-rear direction and the left-right direction.The wall 61 a that sends air to the first front heat sink 171A (theintake air wall of the power supply unit case 61, see FIG. 6B) is formedin front of the first front heat sink 171A. Each of the fins 171 a maybe inclined in the same direction as the wall 61 a. This enables air topass through the heat sink 171A smoothly. In the example of theelectronic apparatus 1, the wall 61 a extends obliquely rearward andleftward from the front edge of the wall 61 a. Similarly to the wall 61a, each of the fins 171 a extends obliquely rearward and leftward fromthe front edge of the fin 171 a. The fins 171 a and the wall 61 a maynot be parallel with each other.

On the other hand, each of the fins 171 b of the first rear heat sink171B is arranged along the front-rear direction. Therefore, the fins 171a of the first front heat sink 171A are inclined with respect to thefins 171 b of the first rear heat sink 171B.

The gap Gn preferably secures a size necessary for air to be mixed. Thegap Gn may, for example, be larger than ⅕ of the width in the front-reardirection of the first front heat sink 171A. The gap Gn may be largerthan ¼ of the width in the front-rear direction of the first front heatsink 171A.

In the example illustrated in FIG. 26A, the intermediate portions 73 hof the plurality of heat pipes 73 are exposed in the gap Gn. Asillustrated in FIG. 26B, the upper surfaces of the heat receivingportions 73 a of the heat pipes 73 and the upper surfaces of the heattransfer member 74 are in contact with the lower edges of the fins 171 aof the first front heat sink. The heat radiating portions 73 c of theplurality of heat pipes 73 are in contact with the lower edges of thefins 171 b of the first rear heat sink 171B. Hence, in the exampleillustrated in FIGS. 26A to 26C, the heat sinks 171A and 171B are bothin contact with parts of the heat pipes 73 in which the widths W1 and W3(FIG. 14A and FIG. 14B) in the upward-downward direction of the heatpipes 73 are uniform.

[Heat Radiating Device on Lower Side]

As illustrated in FIG. 15, the heat radiating device 80 disposed on thelower surface of the circuit board 50 includes a base plate 82, aplurality of fins 81, and a heat pipe 83. As illustrated in FIG. 16A,the heat pipe 83 is disposed between the lower board shield 52 and thecircuit board 50. An opening 52 a is formed in the lower board shield52. The fins 81 are arranged on the inside of the opening 52 a and areexposed to the outside of the lower board shield 52 (lower side of thelower board shield 52 in the example of the electronic apparatus 1). Thefins 81 are arranged in the above-described air flow passage Sb (seeFIG. 8B) formed between the circuit board 50 and the lower housingmember 30B.

The base plate 82 is, for example, a metallic plate of copper, aluminum,stainless steel, or the like. The base plate 82 is formed by pressingthe metallic plate. That is, parts possessed by the base plate 82 areformed by one metallic plate. The plurality of fins 81 are supported bythe base plate 82. The fins 81 are, for example, fixed to the lowersurface of the base plate 82 by solder, for example.

As illustrated in FIG. 15, the heat pipe 83 has a heat receiving portion83 n at a position separated from the fins 81. The heat pipe 83 is in anL-shape, for example. The heat receiving portion 83 n is disposedbetween the optical disk drive 6 and the circuit board 50 describedabove. The fins 81 are arranged in a region not overlapping the opticaldisk drive 6 (region on the right side of the optical disk drive 6 inthe example of the electronic apparatus 1). In a process ofmanufacturing the circuit board 50 (process of mounting electronic partson the circuit board 50), a jig may be pressed against the surface ofthe circuit board 50 to suppress a warp in the circuit board 50. Theheat pipe 83 may have a shape in conformity with a region against whichthe jig is pressed.

The heat receiving portion 83 n is in contact with the electronic parts50 c mounted on the lower surface of the circuit board 50. Theelectronic parts 50 c are, for example, power transistors that generatedriving power for the integrated circuit 50 a (specifically, a CPU)mounted on the upper surface of the circuit board 50, from powersupplied from the power supply unit 60. The parts and devices cooled bythe heat radiating device 80 are not limited to transistors, and theheat radiating device 80 may be used to cool a memory.

As illustrated in FIG. 16A, the heat pipe 83 has a connecting portion 83a on an opposite side from the heat receiving portion 83 n. Theconnecting portion 83 a is located between the fins 81 and the circuitboard 50 and extends in the left-right direction. A holding recessedportion 82 f extending in the left-right direction is formed in thelower surface of the base plate 82. The lower surface of the base plate82 is recessed upward in the holding recessed portion 82 f. A firstthrough hole 82 g that penetrates the base plate 82 in the left-rightdirection is formed at a left end of the holding recessed portion 82 f.A second through hole 82 h that penetrates the base plate 82 in theleft-right direction is formed at a right end of the holding recessedportion 82 f. The connecting portion 83 a is inserted into the holdingrecessed portion 82 f from the first through hole 82 g on the left side,for example, and is held within the holding recessed portion 82 f. Theconnecting portion 83 a is, for example, fixed to the holding recessedportion 82 f by solder. The holding recessed portion 82 f and theconnecting portion 83 a are both a part extending linearly.

As illustrated in FIG. 16A, gaps G1 and G2 are generated between edgesof the opening 52 a of the lower board shield 52 and the fins 81.Specifically, the gap G1 is generated between the edge (left edge) ofthe opening 52 a and a fin 81 located at a left end, and the gap G2 isgenerated between the edge (right edge) of the opening 52 a and a fin 81located at a right end.

As illustrated in FIG. 16A, the base plate 82 may have a plate leftportion 82 c located on the left side of the holding recessed portion 82f. The plate left portion 82 c may cover the lower surface of the heatpipe 83 (surface on the board shield 52 side) and close the gap G1. Thiscan prevent electromagnetic waves from being transmitted outside thelower board shield 52 from the gap G1. The plate left portion 82 c mayhave a size larger than the gap G1 in the front-rear direction and closethe whole of the gap G1.

Similarly, as illustrated in FIG. 16A, the base plate 82 may have aplate right portion 82 d located on the right side of the holdingrecessed portion 82 f. The plate right portion 82 d may cover the lowersurface of the heat pipe 83 (surface on the board shield 52 side) andclose the gap G2.

This can prevent electromagnetic waves from being transmitted outsidethe lower board shield 52 from the gap G2. The plate right portion 82 dmay have a size larger than the gap G2 in the front-rear direction andclose the whole of the gap G2.

As illustrated in FIG. 16A, the plate left portion 82 c has a width T1larger than a distance (gap G1) between the fin 81 located at the leftend among the plurality of fins 81 and the edge (left edge) of theopening 52 a of the board shield 52. Therefore, as viewed in plan of thecircuit board 50, the plate left portion 82 c is superposed on the fin81 located at the left end and is also superposed on the edge of theopening 52 a of the board shield 52. As a result, electromagnetic wavescan be prevented from leaking from the gap G1 effectively. In theexample of the electronic apparatus 1, a plurality of fins 81 aresuperposed on the plate left portion 82 c.

As illustrated in FIG. 16A, the plate right portion 82 d has a width T2larger than a distance (gap G2) between the fin 81 located at the rightend among the plurality of fins 81 and the edge (right edge) of theopening 52 a of the board shield 52. Therefore, as viewed in plan of thecircuit board 50, the plate right portion 82 d is superposed on the fin81 located at the right end and is also superposed on the edge of theopening 52 a of the board shield 52. As a result, electromagnetic wavescan be prevented from leaking from the gap G2 effectively. In theexample of the electronic apparatus 1, a plurality of fins 81 are alsosuperposed on the plate right portion 82 d.

As illustrated in FIG. 16B, the base plate 82 has a plate front portion82 a and a plate rear portion 82 b located on opposite sides from eachother in the front-rear direction with the holding recessed portion 82 finterposed therebetween. The plate front portion 82 a, the plate rearportion 82 b, the plate left portion 82 c, and the plate right portion82 d are coupled to one another and surround the holding recessedportion 82 f. The four parts 82 a to 82 d are located in the same planealong the circuit board 50. The edges of the fins 81 are fixed to thelower surface of the plate front portion 82 a and the lower surface ofthe plate rear portion 82 b by solder, for example. Heat transmittedfrom the heat pipe 83 to the holding recessed portion 82 f istransmitted to the fins 81 via the plate front portion 82 a and theplate rear portion 82 b.

The plate front portion 82 a extends frontward from the holding recessedportion 82 f and is superposed on the edge of the opening 52 a of theboard shield 52. The plate rear portion 82 b extends rearward from theholding recessed portion 82 f and is superposed on the edge of theopening 52 a of the board shield 52. Thus, the base plate 82 may besuperposed on the entire perimeter of the edges of the opening 52 a ofthe board shield 52. This can effectively prevent electromagnetic wavesfrom leaking.

Each of the parts 82 a to 82 d may be fixed to the edge of the opening52 a of the board shield 52 by a fixture such as a screw or a rivet. Thefixing structure of the base plate 82 and the lower board shield 52 isnot limited to the example of the electronic apparatus 1. For example,only the plate front portion 82 a and the plate rear portion 82 b may beprovided with a fixture for fixing the base plate 82 to the lower boardshield 52.

As illustrated in FIG. 16B, a width W11 in the left-right direction ofthe first through hole 82 g may be larger than a width (width in theleft-right direction) of one fin 81. Similarly, a width W12 in theleft-right direction of the second through hole 82 h may be larger thanthe width (width in the left-right direction) of one fin 81. The firstthrough hole 82 g is closed by the plurality of fins 81. The secondthrough hole 82 h is also closed by the plurality of fins 81. Each fin81 has, at an upper edge thereof, a fixing portion 81 b bent to anadjacent fin 81. The fixing portion 81 b is in contact with the adjacentfin 81, and there is no gap between the two fins 81 adjacent to eachother. This can also prevent electromagnetic waves from leaking from arange between the two fins 81 adjacent to each other.

As illustrated in FIG. 16B, the base plate 82 may have a stopper 82 kthat faces an end in the left-right direction (right end in the exampleof the electronic apparatus 1) of the heat pipe 83, in the left-rightdirection. When the connecting portion 83 a of the heat pipe 83 isinserted into the holding recessed portion 82 f from the left side in aprocess of manufacturing the heat radiating device 80, the stopper 82 kcan reduce a relative positional displacement between the connectingportion 83 a and the holding recessed portion 82 f.

Incidentally, in the example of the electronic apparatus 1, the baseplate 82 has the plate left portion 82 c and the plate right portion 82d that are superposed on the edges of the opening 52 a of the boardshield 52, on the right side and left side of the holding recessedportion 82 f, respectively. Unlike this example, only either the plateleft portion 82 c or the plate right portion 82 d may be superposed onthe edge of the opening 52 a of the board shield 52.

Further, in another example, the base plate 82 may not have the holdingrecessed portion 82 f. In such a case, the heat radiating device 80 mayhave a back plate that sandwiches the connecting portion 83 a of theheat pipe 83 together with the base plate 82. FIGS. 17A to 17C arediagrams illustrating an example of such a heat radiating device.

In the example illustrated in these diagrams, a heat radiating device180 has a base plate 182 and a back plate 184. As illustrated in FIG.17B, the base plate 182 is disposed between the connecting portion 83 aof the heat pipe 83 and the fins 81. The upper edges of the fins 81 arefixed to the base plate 182. Unlike the base plate 82 described above,no holding recessed portion is formed in the base plate 182. The backplate 184 covers the upper surface of the connecting portion 83 a and isattached to the base plate 182. A holding recessed portion 184 a thatextends in the left-right direction is formed in the back plate 184. Theconnecting portion 83 a of the heat pipe 83 is fitted in this holdingrecessed portion. The back plate 184 has a plate front portion 184 b anda plate rear portion 184 c located on opposite sides from each otherwith the holding recessed portion 184 a interposed therebetween. Theparts 184 b and 184 c are attached to the base plate 182. Incidentally,in the heat radiating device 180, unlike the heat radiating device 80,the connecting portion 83 a of the heat pipe 83 may be curved, forexample, instead of being linear. In such a case, the holding recessedportion 184 a may be curved in conformity with the connecting portion 83a.

As illustrated in FIG. 17C, the base plate 182 has a plate left portion182 c located on the left side of the fins 81 and a plate right portion182 d located on the right side of the fins 81. The plate left portion182 c closes the gap G1. The plate right portion 182 d closes the gapG2. This can prevent electromagnetic waves from leaking from the gaps G1and G2.

As illustrated in FIG. 17C, the plate left portion 182 c extendsleftward beyond the edge (left edge) of the opening 52 a of the boardshield 52 and overlaps the board shield 52. The plate right portion 182d extends rightward beyond the edge (right edge) of the opening 52 a ofthe board shield 52 and overlaps the board shield 52. This can preventelectromagnetic waves from leaking from the gaps G1 and G2 moreeffectively.

As illustrated in FIG. 17B, the base plate 182 has a plate front portion182 a and a plate rear portion 182 b located on opposite sides from eachother in the front-rear direction with the connecting portion 83 ainterposed therebetween. The plate front portion 182 a and the platerear portion 182 b also respectively extend frontward and rearwardbeyond the edges of the opening 52 a of the board shield 52 and overlapthe board shield 52. Thus, the base plate 182 may be superposed on theentire perimeter of the edges of the opening 52 a of the board shield52. This can effectively prevent electromagnetic waves from leaking.

The back plate 184 may have substantially the same size as the baseplate 182 in at least one of the left-right direction and the front-reardirection. In the example of the electronic apparatus 1, as illustratedin FIG. 17A, a size K2 in the front-rear direction of the back plate 184is the same as that of the base plate 182. In addition, a size K1 in theleft-right direction of the back plate 184 is the same as that of thebase plate 182. According to this structure of the back plate 184 andthe base plate 182, heat transmitted from the heat pipe 83 to the backplate 184 is transmitted to the whole of the base plate 182 easily andis therefore transmitted to the whole of the fins 81 easily.Incidentally, the back plate 184 may have substantially the same size asthe base plate 182 in only either the left-right direction or thefront-rear direction. Here, the back plate 184 and the base plate 182having the same size in the front-rear direction means that frontmostportions thereof can be attached to the board shield 52 by a commonfixture (a screw or a rivet) and that rearmost portions thereof can beattached to the board shield 52 by a common fixture. For example,attachment holes into which a common fixture is to be inserted areformed in each of the frontmost portions and the rearmost portions ofthe plates 184 and 182. Similarly, the back plate 184 and the base plate182 having the same size in the left-right direction means thatrightmost portions thereof can be attached to the board shield 52 by acommon fixture and that leftmost portions thereof can be attached to theboard shield 52 by a common fixture.

In addition, according to this structure, unlike the base plate 82described above, the holes penetrating the base plate 182 (through holes82 g and 82 h described above) are not formed. Therefore, a leakage ofelectromagnetic waves can be prevented more effectively.

[Memory Housing Chamber]

As illustrated in FIG. 15, a ground pattern 50 f that includes aconductor and functions as an electric ground is formed on the lowersurface of the circuit board 50. In FIG. 15, the ground pattern 50 f isshaded. The ground pattern 50 f surrounds the entire perimeter of aregion B1 on which electronic parts 50 c and 50 e and the like aremounted (the region will hereinafter be referred to as a shieldedregion). The lower board shield 52 covers the shielded region B1. Thelower board shield 52 has ground contact portions 52 b (see FIG. 7C)fixed to the ground pattern 50 f by a fixture such as a screw.

As illustrated in FIG. 15, a memory connector 50 g from which asemiconductor memory 55 (see FIG. 18A) is detachable may be mounted on aregion on the outside of the shielded region B1 in the lower surface ofthe circuit board 50. In the example of the electronic apparatus 1, thesemiconductor memory 55 is disposed rightward from the memory connector50 g. The lower board shield 52 may have a connector cover 52 c (seeFIG. 18A) that covers the memory connector 50 g. A memory housingchamber R1 (see FIG. 18A) that houses the semiconductor memory 55 isdefined on the lower side of the circuit board 50.

As illustrated in FIG. 18C, the lower board shield 52 has shield walls52 e and 52 f formed along the memory housing chamber R1. According tothis structure, it is possible to reduce an effect of static electricityon the semiconductor memory 55 while suppressing an increase in thenumber of parts. The shield walls 52 e and 52 f are walls higher thanthe semiconductor memory 55 and also have a length (width in theleft-right direction) corresponding to the semiconductor memory 55.

In the example of the electronic apparatus 1, the memory housing chamberR1 is defined near a front surface 10 a (see FIG. 8A) of the electronicapparatus 1. As illustrated in FIG. 15, the memory housing chamber R1 islocated forward of the center of the circuit board 50 in the front-reardirection and is, for example, formed along a front edge 50 h of thecircuit board 50. The shield wall 52 e is formed on the front side ofthe memory housing chamber R1. According to this structure, when theuser touches the front surface 10 a of the electronic apparatus 1, aflow of static electricity to the semiconductor memory 55 can besuppressed by the shield wall 52 e.

As illustrated in FIG. 18C, the shield wall 52 f may be formed on therear side of the memory housing chamber R1. According to this, theeffect of static electricity on the semiconductor memory 55 can besuppressed more effectively.

As illustrated in FIG. 15, the ground pattern 50 f may have groundportions 50 i and 50 j formed along the memory housing chamber R1. Theground portions 50 i and 50 j, for example, have a length (length in theleft-right direction) corresponding to the memory housing chamber R1.The ground portion 50 i is formed on the front side of the memoryhousing chamber R1. The ground portion 50 j is formed on the rear sideof the memory housing chamber R1. In the following, the ground portion50 i will be referred to as a front ground portion, and the groundportion 50 j will be referred to as a rear ground portion.

As illustrated in FIG. 18C, the lower board shield 52 has a contactportion 52 g in contact with the front ground portion 50 i and a contactportion 52 h in contact with the rear ground portion 50 j. The shieldwall 52 e on the front side extends downward from the contact portion 52g. The shield wall 52 f on the rear side extends downward from thecontact portion 52 h. According to this structure, distances from theshield walls 52 e and 52 f to the ground pattern 50 f of the circuitboard 50 are decreased. As a result, the effect of static electricitycan be reduced more effectively.

Incidentally, the structure of the ground pattern 50 f and the structureof the lower board shield 52 are not limited to the example illustratedin the electronic apparatus 1. For example, the ground pattern 50 f mayhave only one of the two ground portions 50 i and 50 j (for example, thefront ground portion 50 i). In such a case, the lower board shield 52may have only one of the two contact portions 52 g and 52 h (forexample, the contact portion 52 g on the front side).

As illustrated in FIG. 18A, the memory housing chamber R1 may be coveredby a memory cover 56. The memory cover 56 includes, for example, aconductive material (for example, a metal such as copper, aluminum, oriron). The memory cover 56 is electrically connected to the shield walls52 e and 52 f. According to this, the effect of static electricity onthe semiconductor memory 55 can be suppressed even more effectively.

In the example of the electronic apparatus 1, the memory cover 56 iselectrically connected to the shield wall 52 e through a conductivecushion 56 a (FIG. 18C) disposed between an edge of the memory cover 56and an edge of the shield wall 52 e on the front side. In addition, thememory cover 56 is electrically connected to the shield wall 52 fthrough a conductive cushion 56 b disposed between an edge of the memorycover 56 and an edge of the shield wall 52 f on the rear side.

As illustrated in FIG. 18C, an opening 30 d that exposes the memoryhousing chamber R1 is formed in the lower housing member 30B. Supportingwalls 37 a, 37 b, and 37 c that surround the memory housing chamber R1may be formed on the lower housing member 30B. The supporting walls 37a, 37 b, and 37 c are walls extending toward the circuit board 50 fromedges of the opening 30 d. The supporting walls 37 a, 37 b, and 37 c cansecure a strength of the lower housing member 30B on the periphery ofthe opening 30 d.

As illustrated in FIG. 18C, the shield walls 52 e and 52 f may belocated on the inside of the supporting walls 37 a, 37 b, and 37 c. Theshield wall 52 e on the front side is, for example, disposed on theinside of the supporting wall 37 a on the front side and along thesupporting wall 37 a. The shield wall 52 f on the rear side is, forexample, disposed on the inside of the supporting wall 37 b on the rearside and along the supporting wall 37 b. In the example of theelectronic apparatus 1, the board shield 52 does not have a shield walllocated on the inside of the supporting wall 37 c formed on the rightside of the memory housing chamber R1. Unlike the example of theelectronic apparatus 1, the board shield 52 may have a shield walllocated on the inside of the supporting wall 37 c.

The outer peripheral edge of the memory cover 56 is, for example,disposed at lower edges of the supporting walls 37 a, 37 b, and 37 c. Asillustrated in FIG. 18A, a projecting portion 56 c is formed at an endportion (left end in the example illustrated in the electronic apparatus1) of the memory cover 56. An opening into which the projecting portion56 c is fitted in a horizontal direction is formed in the lower housingmember 30B. An end portion on an opposite side (right end in the exampleillustrated in the electronic apparatus 1) of the memory cover 56 isdisposed on the supporting wall 37 c and is fixed to the supporting wall37 c. For example, a hole is formed in the supporting wall 37 c, and theend portion of the memory cover 56 is fixed to this hole by a fixturesuch as a screw 58 a.

The semiconductor memory 55 may be fixed to the circuit board 50 or theupper board shield 51 at a position separated from the memory connector50 g. For example, as illustrated in FIG. 18A, a right end 55 a of thesemiconductor memory 55 may be fixed to a screw hole 51 b formed in theupper board shield 51 by a screw 58 b. In such a case, a spacer 57 maybe disposed between the upper board shield 51 and the right end 55 a ofthe semiconductor memory 55. A hole 50 k used for disposing the spacer57 may be formed at a position corresponding to the screw hole 51 b inthe circuit board 50.

The electronic apparatus 1 may allow a plurality of semiconductormemories having different storage capacities to be used selectively.Such semiconductor memories have different lengths in the left-rightdirection according to the storage capacities. Accordingly, asillustrated in FIG. 18A, a plurality of screw holes 51 b may be formedin the upper board shield 51 such that such a plurality of semiconductormemories having different lengths can be fixed to the upper board shield51. In addition, in the circuit board 50, holes used for disposing thespacer 57 may be formed at positions corresponding to the screw holes 51b.

Vent holes H1 (see FIG. 18A and FIG. 18B) that allow a flow of airbetween the inside and the outside of the memory housing chamber R1 in astate in which the memory cover 56 is closed may be formed in the memoryhousing chamber R1. This can improve a heat radiation property for thesemiconductor memory 55.

As described above, the memory housing chamber R1 is disposed near thefront surface 10 a of the electronic apparatus 1. The vent holes H1 maybe formed in a wall portion on the rear side of the memory housingchamber R1. In the example of the electronic apparatus 1, the vent holesH1 may be provided in the shield wall 52 f on the rear side or thesupporting wall 37 b on the rear side. In addition, the vent holes H1may open toward the rear side of the electronic apparatus 1. Accordingto this structure of the vent holes H1, the vent holes H1 are distantfrom the front surface 10 a of the electronic apparatus 1, andtherefore, the vent holes H1 can be effectively prevented from becominga passage for static electricity.

In the example of the electronic apparatus 1, a plurality of gaps 52 i(see FIG. 19) are formed in the shield wall 52 f on the rear side. Asillustrated in FIG. 18B, the lower edge of the supporting wall 37 b ofthe lower housing member 30B has recessed portions 37 e at positionscorresponding to the gaps 52 i. The vent holes H1 that open toward therear side of the electronic apparatus 1 are formed between the recessedportions 37 e and an edge of the memory cover 56. An attachment hole 52j (see FIG. 18B) used for fixing the ground contact portion 52 h of thelower board shield 52 to the circuit board 50 may be formed in the gaps52 i.

The above-described lower flow passage Ub (see FIG. 20A) is formedbetween the lower surface of the lower housing member 30B and the lowerexterior panel 20B. The vent holes H1 open in the lower flow passage Ub.In addition, the vent holes H1 open toward the inlet port 31 b of thelower housing member 30B from the memory housing chamber R1 (see FIG.8A).

Therefore, when the cooling fan 5 is driven, an airflow from the insideof the memory housing chamber R1 to the inlet port 31 b through the ventholes H1 is formed.

In addition to the vent holes H1, holes opening to the outside of thememory housing chamber R1 may be formed in the wall portions definingthe memory housing chamber R1, the wall portions being the shield walls52 e and 52 f, the supporting walls 37 a, 37 b, and 37 c, the circuitboard 50, and the like. When the cooling fan 5 is driven, air flows intothe inside of the memory housing chamber R1 through the holes. The holesopening to the outside of the memory housing chamber R1, that is, airintake holes, are, for example, the holes 50 k formed in the circuitboard 50 to fix the semiconductor memory 55.

[Exterior Panel]

As described above, the electronic apparatus 1 has the upper exteriorpanel 20A attached to the upper surface of the apparatus main body 10and the lower exterior panel 20B attached to the lower surface of theapparatus main body 10. The apparatus main body 10 has the upper housingmember 30A and the lower housing member 30B combined with each other inthe upward-downward direction. The upper exterior panel 20A is attachedto the upper surface of the upper housing member 30A. The lower exteriorpanel 20B is attached to the lower surface of the lower housing member30B.

As illustrated in FIG. 1C, the upper exterior panel 20A may have, on aright side thereof, a right projecting portion 20 a that projectsrightward beyond the position of a right side surface 10 b of theapparatus main body 10 (right side external surface of the frontexterior panel 35). In addition, the upper exterior panel 20A may have,on a left side thereof, a left projecting portion 20 b (FIG. 1G) thatprojects leftward beyond the position of a left side surface 10 c of theapparatus main body 10 (left side surface of the housing 30). Asillustrated in FIG. 1B, the projecting portions 20 a and 20 b maycontinue from a rear edge to a front edge of the upper exterior panel20A.

The projecting portions 20 a and 20 b can protect the apparatus mainbody 10. For example, when the electronic apparatus 1 is placedvertically such that the right side surface 10 b of the electronicapparatus 1 is on the lower side, the right projecting portion 20 aabuts against a floor surface and supports the apparatus main body 10,so that the side surface of the apparatus main body 10 can be preventedfrom being damaged or soiled.

Similarly to the upper exterior panel 20A, as illustrated in FIG. 1C,the lower exterior panel 20B may have, on a right side thereof, a rightprojecting portion 20 c that projects rightward beyond the position ofthe right side surface 10 b of the apparatus main body 10, and have, ona left side thereof, a left projecting portion 20 d (see FIG. 1G) thatprojects leftward beyond the position of the left side surface 10 c ofthe apparatus main body 10. The projecting portions 20 c and 20 d maycontinue from a rear edge to a front edge of the lower exterior panel20B. According to this structure of the exterior panels 20A and 20B, theapparatus main body 10 can be protected more effectively.

As illustrated in FIG. 1E, the upper exterior panel 20A may have, on afront side thereof, a front projecting portion 20 e that projectsfrontward beyond the position of the front surface 10 a of the apparatusmain body 10 (front surface of the front exterior panel 35). Similarly,the lower exterior panel 20B may have, on a front side thereof, a frontprojecting portion 20 f that projects frontward beyond the position ofthe front surface 10 a of the apparatus main body 10. According to thisstructure of the exterior panels 20A and 20B, the front surface 10 a ofthe apparatus main body 10 and parts arranged in the front surface 10 a(for example, the buttons 2 a and 2 b, the connector 3 a and 3 b, andthe like) can be protected. The front projecting portion 20 e continuesfrom a right edge to a left edge of the upper exterior panel 20A. Thefront projecting portion 20 f continues from a right edge to a left edgeof the lower exterior panel 20B. In addition, the exterior panels 20Aand 20B may have a rear projecting portion that projects rearward beyondthe position of the rear surface of the apparatus main body 10 (rearsurface of the housing 30).

Incidentally, the exterior panels 20A and 20B may have projectingportions on only a part of the right side, the left side, and the frontside thereof. For example, the exterior panels 20A and 20B may not havethe projecting portions 20 e and 20 f on the front side. In addition,only one of the two exterior panels 20A and 20B may have the projectingportions.

As illustrated in FIG. 1A, the upper exterior panel 20A has a shapeobtained by gently curving one plate in a thickness direction thereofand does not have, at an outer peripheral edge thereof, a wall portionthat drops toward the lower exterior panel 20B. That is, the upperexterior panel 20A is not in a box shape. Hence, the upper exteriorpanel 20A has a right end surface 20 g (see FIG. 1E) facing rightwardand having a width T3 (width in the upward-downward direction)corresponding to the thickness of the upper exterior panel 20A.Similarly, the upper exterior panel 20A has a left end surface facingleftward and having a width corresponding to the thickness of the upperexterior panel 20A, a front end surface facing frontward and having awidth corresponding to the thickness of the upper exterior panel 20A,and a rear end surface facing rearward and having a width correspondingto the thickness of the upper exterior panel 20A.

Similarly to the upper exterior panel 20A, the lower exterior panel 20Bdoes not have, at an outer peripheral edge thereof, a wall portion thatextends toward the upper exterior panel 20A. Hence, the lower exteriorpanel 20B has a right end surface 20 h (see FIG. 1G) facing rightwardand having a width T4 (width in the upward-downward direction)corresponding to the thickness of the lower exterior panel 20B, a leftend surface facing leftward and having a width corresponding to thethickness of the lower exterior panel 20B, a front end surface facingfrontward and having a width corresponding to the thickness of the lowerexterior panel 20B, and a rear end surface facing rearward and having awidth corresponding to the thickness of the lower exterior panel 20B.

[Curve of Exterior Panel]

The upper exterior panel 20A may have a curved section in a cuttingplane that is along the upward-downward direction and intersects theleft-right direction. This can increase the strength of the exteriormember when the electronic apparatus 1 is placed vertically, as comparedwith a case where the upper exterior panel 20A is a flat plate. Asillustrated in FIG. 20A and FIG. 20B, the upper exterior panel 20A mayhave sections curved in different manners in two cutting planes that arealong the upward-downward direction and intersect each other. Here, thetwo cutting planes are, for example, a cutting plane indicated by a lineXXa-XXa illustrated in FIG. 1D and a cutting plane indicated by a lineXXb-XXb. The cutting planes are not limited to the example illustratedin FIG. 1D and may, for example, be planes along the upward-downwarddirection and the front-rear direction. Also in such a case, thestrength of the upper exterior panel 20A (strength against a forceacting in the left-right direction) can be increased.

In FIG. 1D, a first position P1, a second position P2 located on anopposite side of a center Pc of the upper exterior panel 20A from thefirst position P1, a third position P3, and a fourth position P4 locatedon an opposite side of the center Pc of the upper exterior panel 20Afrom the third position P3 are set at four corners of the upper exteriorpanel 20A. In FIG. 1D, the first position P1 is given at a right frontcorner, the second position P2 is given at a left rear corner, the thirdposition P3 is given at a left front corner, and the fourth position P4is given at a right rear corner.

When the four positions are thus defined in the example of theelectronic apparatus 1, a line L1 that connects the first position P1and the second position P2 to each other and is along the upper surfaceof the upper exterior panel 20A is a curve bulging downward, asillustrated in FIG. 20A. In other words, when a cutting plane along afirst diagonal line of the electronic apparatus 1 is viewed, the upperexterior panel 20A is curved along an arc about a point separated upwardfrom the upper exterior panel 20A. Here, the “first diagonal line” isthe line XXa-XXa illustrated in FIG. 1D.

On the other hand, a line L2 that connects the third position P3 and thefourth position P4 to each other and is along the upper surface of theupper exterior panel 20A is a curve bulging upward, as illustrated inFIG. 20B. In other words, when a cutting plane along a second diagonalline of the electronic apparatus 1 is viewed, the upper exterior panel20A may be curved along an arc about a point separated downward from theupper exterior panel 20A. Here, the “second diagonal line” is the lineXXb-XXb illustrated in FIG. 1D.

According to such curves of the upper exterior panel 20A, as illustratedin FIG. 20A, the thickness (width in the upward-downward direction) ofthe electronic apparatus 1 at the right front corner (first position P1)of the electronic apparatus 1 and the thickness (width in theupward-downward direction) of the electronic apparatus 1 at the leftrear corner (second position P2) of the electronic apparatus 1 areincreased. Therefore, when the electronic apparatus 1 is placedvertically, the attitude of the electronic apparatus 1 can bestabilized.

For example, when the electronic apparatus 1 is placed vertically suchthat the right side surface of the electronic apparatus 1 is on thelower side, the right front corner (first position P1) having a largethickness is on the lower side and supports the electronic apparatus 1.In addition, when the electronic apparatus 1 is placed such that thefront surface of the electronic apparatus 1 is on the lower side, theright front corner (first position P1) having a large thickness is alsoon the lower side. When the electronic apparatus 1 is placed verticallysuch that the left side surface of the electronic apparatus 1 is on thelower side, on the other hand, the left rear corner (second position P2)having a large thickness is on the lower side and supports theelectronic apparatus 1. Hence, according to the above-described curvesof the upper exterior panel 20A, when the electronic apparatus 1 isplaced vertically, the attitude of the electronic apparatus 1 can bestabilized.

FIG. 20A illustrates a first distance D1 at the first position P1 (rightfront corner) and a second distance D2 at the second position P2 (leftrear corner) as distances from the horizontal plane Hp1 including thecircuit board 50 to the upper surface of the upper exterior panel 20A.In addition, FIG. 20B illustrates a third distance D3 at the thirdposition P3 (left front corner) and a fourth distance D4 at the fourthposition P4 (right rear corner) as distances from the horizontal planeHp1 including the circuit board 50 to the upper surface of the upperexterior panel 20A. As described above, the line L1 connecting the firstposition P1 and the second position P2 to each other, the first positionP1 and the second position P2 being defined on a diagonal line of theupper exterior panel 20A, is a curve bulging downward, and the line L2connecting the third position P3 and the fourth position P4 to eachother, the third position P3 and the fourth position P4 being on anotherdiagonal line of the upper exterior panel 20A, is a curve bulgingupward. Therefore, each of the first distance D1 and the second distanceD2 is larger than each of the third distance D3 and the fourth distanceD4. It is therefore possible to realize smooth air intake and exhaust byarranging devices and parts of a cooling system near the first positionP1 and near the second position P2.

For example, as illustrated in FIG. 1D, as viewed in plan of theelectronic apparatus 1, a line connecting the center Pc of the upperexterior panel 20A and the first position P1 to each other (line XXa-XXaindicating a cutting plane) passes the inlet port Ea (see FIG. 1C)formed between the upper exterior panel 20A and the upper surface of theupper housing member 30A. In addition, the line connecting the center Pcof the upper exterior panel 20A and the first position P1 to each otherpasses the upper flow passage Ua (see FIG. 20A) formed between the upperexterior panel 20A and the recessed plate portion 32 a (see FIG. 2A) ofthe upper housing member 30A. This facilitates securing of a sufficientwidth in the upward-downward direction of the inlet port Ea and asufficient width in the upward-downward direction of the upper flowpassage Ua.

In addition, as viewed in plan of the electronic apparatus 1, a lineconnecting the center Pc of the upper exterior panel 20A and the secondposition P2 to each other (line XXa-XXa indicating a cutting plane) maypass a flow passage from the cooling fan 5 to the exhaust port Mprovided in the back surface of the electronic apparatus 1. In theexample of the electronic apparatus 1, the air flowing out of thecooling fan 5 passes through the inside of the power supply unit case 61and is exhausted from the exhaust port M. As viewed in plan of theelectronic apparatus 1, the line connecting the center Pc of the upperexterior panel 20A and the second position P2 to each other (lineXXa-XXa indicating a cutting plane) passes an air flow passage formed inthe rear portion (case rear portion 61 c) of the power supply unit case61. Therefore, a sufficient size in the upward-downward direction of therear portion of the power supply unit case 61 is secured easily, andexhaust efficiency can be improved.

In addition, as viewed in plan of the electronic apparatus 1, the lineconnecting the center Pc of the upper exterior panel 20A and the secondposition P2 to each other passes the rear wall 61 i (see FIG. 7C) of thepower supply unit case 61 in which the exhaust holes 61 g are formed,and the rear portion 61 k (see FIG. 7C) of the upper wall 61 j in whichthe exhaust holes 61 h are formed. This facilitates securing of asufficient size in the upward-downward direction of the rear wall 61 iof the power supply unit case 61 and securing of a sufficient width inthe upward-downward direction of the air flow passage Se (see FIG. 7C)formed between the rear portion 61 k of the upper wall 61 j and theupper housing member 30A.

The lower exterior panel 20B may also be curved as a whole. For example,as illustrated in FIG. 20A, the lower exterior panel 20B is curved whenthe cutting plane along the first diagonal line of the electronicapparatus 1 (line XXa-XXa in FIG. 1D) is viewed. As illustrated in FIG.20B, when the cutting plane along the second diagonal line of theelectronic apparatus 1 (line XXb-XXb in FIG. 1D) is viewed, the lowerexterior panel 20B may be curved in a manner different from that in thecutting plane illustrated in FIG. 20A. As described above, the opticaldisk drive 6 is disposed on the lower side of the circuit board 50. Theoptical disk drive 6 is located in a left portion of the electronicapparatus 1. Therefore, a left portion of the lower exterior panel 20Bis bulged downward so as to cover the lower side of the optical diskdrive 6. A right portion Br of the lower exterior panel 20B may have ashape symmetric to a right portion of the upper exterior panel 20A.

Incidentally, the electronic apparatus 1 may not have the optical diskdrive 6 on the lower side of the circuit board 50. In such a case, thewhole of the shape (curve) of the lower exterior panel 20B may besymmetric to the shape (curve) of the upper exterior panel 20A. FIG. 21Aand FIG. 21B are sectional views illustrating a lower exterior panelaccording to such a modification. In an example illustrated in thesediagrams, a lower exterior panel 120B and the upper exterior panel 20Ahave shapes symmetric with respect to a horizontal plane Hp2. FIG. 21Aillustrates sections of the exterior panels 20A and 120B which areobtained in the same cutting plane as the cutting plane indicated by theline XXa-XXa in FIG. 1D. FIG. 21B illustrates sections of the exteriorpanels 20A and 120B which are obtained in the same cutting plane as thecutting plane indicated by the line XXb-XXb in FIG. 1D. FIG. 21C is afront view of an electronic apparatus 101 having the exterior panels 20Aand 120B illustrated in FIG. 21A and FIG. 21B.

In the example illustrated in FIG. 21A and FIG. 21B, a fifth positionP5, a sixth position P6 located on an opposite side of a center Pc ofthe lower exterior panel 120B from the fifth position P5, a seventhposition P7, and an eighth position P8 located on an opposite side ofthe center Pc of the lower exterior panel 120B from the seventh positionP7 are set at four corners of the lower exterior panel 120B. Forexample, the fifth position P5 is given at a right front corner of thelower exterior panel 120B, the sixth position P6 is given at a left rearcorner of the lower exterior panel 120B, the seventh position P7 isgiven at a left front corner of the lower exterior panel 120B, and theeighth position P8 is given at a right rear corner of the lower exteriorpanel 120B. Hence, as viewed in plan of the electronic apparatus 1, thefifth position P5, the sixth position P6, the seventh position P7, andthe eighth position P8 respectively correspond to the first position P1,the second position P2, the third position P3, and the fourth positionP4 described above.

When the four positions are thus defined in the lower exterior panel120B, a line L3 that connects the fifth position P5 and the sixthposition P6 to each other and is along the lower surface of the lowerexterior panel 120B may be a curve bulging upward, as illustrated inFIG. 21A. On the other hand, a line L4 that connects the seventhposition P7 and the eighth position P8 to each other and is along thelower surface of the lower exterior panel 120B may be a curve bulgingdownward, as illustrated in FIG. 21B.

Incidentally, the curved form of the upper exterior panel 20A is notlimited to the example of the electronic apparatus 1. For example, theabove-described four positions P1 to P4 defining the curved form of theupper exterior panel 20A may not be the four corners of the upperexterior panel 20A. For example, the first position P1 may be defined ata center of the front edge of the upper exterior panel 20A, the secondposition P2 may be defined on an opposite side of the center Pc of theupper exterior panel 20A from the first position P1, the third positionP3 may be defined at a center of the right edge of the upper exteriorpanel 20A, and the fourth position P4 may be defined on an opposite sideof the center Pc of the upper exterior panel 20A from the third positionP3. When the four positions P1 to P4 are thus defined, the line thatconnects the first position P1 and the second position P2 to each otherand is along the upper surface of the upper exterior panel 20A may, forexample, be a curve bulging downward. On the other hand, the line thatconnects the third position P3 and the fourth position P4 to each otherand is along the upper surface of the upper exterior panel 20A may be acurve bulging upward.

In such a case, the curved form of the lower exterior panel 20B maycorrespond to the curved form of the upper exterior panel 20A. Forexample, the whole of the shape (curve) of the lower exterior panel 20Bmay be symmetric to the shape (curve) of the upper exterior panel 20A.Further, in another example, while only the upper exterior panel 20A iscurved as described above, the lower exterior panel 20B may be in a flatplate shape. In yet another example, a part of the upper exterior panel20A or a part of the lower exterior panel 20B may include a flatsurface.

[Exterior Panel Attachment Structures]

As illustrated in FIG. 2A and FIG. 22, a plurality of attachment holes30 e and 30 f are formed in the upper surface of the apparatus main body10 (the upper surface of the upper housing member 30A). A plurality ofattachment target projecting portions 21 and 22 (see FIG. 2B) are formedon the lower surface of the upper exterior panel 20A. The attachmenttarget projecting portions 21 and 22 are fitted in the attachment holes30 e and 30 f, respectively. The attachment holes 30 e and 30 f are, forexample, holes that penetrate the upper housing member 30A.

In FIG. 22, fitting directions in which the attachment target projectingportions 21 and 22 are respectively fitted into the attachment holes 30e and 30 f are indicated by arrows Da. The fitting directions Da, forexample, correspond to a direction in which the attachment targetprojecting portions 21 and 22 project from the lower surface of theupper exterior panel 20A. In addition, the fitting directions Da, forexample, correspond to a direction in which the attachment holes 30 eand 30 f penetrate the upper housing member 30A. Each of the fittingdirections Da in which the plurality of attachment target projectingportions 21 and 22 are fitted into the attachment holes 30 e and 30 f isparallel with the other. The fitting direction Da may be inclined withrespect to a plane perpendicular to the upward-downward direction(horizontal plane Hp3 parallel with the circuit board 50 in FIG. 22).For example, the fitting direction Da may be a direction inclined withrespect to the horizontal plane Hp3 and along a plane parallel with theupward-downward direction and the left-right direction.

As described above, the upper exterior panel 20A is curved in mannersdifferent from each other in two cutting planes that are along theupward-downward direction and intersect each other. That is, the upperexterior panel 20A is curved so as to bulge downward in the cuttingplane along the first diagonal line (line XXa-XXa in FIG. 1D) and iscurved so as to bulge upward in the cutting plane along the seconddiagonal line (line XXb-XXb in FIG. 1D). As illustrated in FIG. 22, theupper surface of the apparatus main body 10 is also curved in conformitywith the upper exterior panel 20A. When the fitting direction Da isinclined with respect to the horizontal plane Hp3, the curved upperexterior panel 20A can be attached to the upper surface of the apparatusmain body 10 that is similarly curved, and the upper exterior panel 20Aand the upper surface of the apparatus main body 10 can be brought intoclose contact with each other.

FIG. 23 is a schematic diagram of assistance in explaining this. In anexample illustrated in this figure, a horizontal portion 30 i and aninclined portion 30 j are formed in the upper housing member 30A. Ahorizontal portion 20 i and an inclined portion 20 j are also formed inthe upper exterior panel 20A. The attachment target projecting portions21 and 22 project in the direction Da inclined with respect to thehorizontal plane. The attachment holes 30 e and 30 f penetrate the upperhousing member 30A in the direction Da inclined with respect to thehorizontal plane Hp3. The fitting direction Da is inclined more greatlythan the inclined portions 30 j and 20 j. That is, an angle θ1 formedbetween the horizontal plane Hp3 and the fitting direction Da is largerthan an angle θ2 formed between the horizontal plane Hp3 and theinclined portions 20 j and 30 j. Therefore, the attachment targetprojecting portions 21 and 20 can be inserted into the attachment holes30 e and 30 f without the occurrence of an interference between theinclined portion 20 j and the inclined portion 30 j and an interferencebetween the horizontal portion 20 i and the horizontal portion 30 i. Inaddition, after the insertion of the attachment target projectingportions 21 and 20, the inclined portion 20 j and the inclined portion30 j can be brought into close contact with each other, and thehorizontal portion 20 i and the horizontal portion 30 i can be broughtinto close contact with each other.

For a reduction in size in the upward-downward direction of theelectronic apparatus 1, a method is effective in which the upperexterior panel 20A and the upper housing member 30A are attached to eachother by, for example, sliding the upper exterior panel 20A with respectto the upper housing member 30A in a right direction or a leftdirection. However, that method causes a gap between the inclinedportions 20 j and 30 j and an interference between another inclinedportion of the upper exterior panel 20A and the upper housing member30A. On the other hand, in the example of the electronic apparatus 1,the fitting direction Da is inclined more greatly than the inclinedportions 20 j and 30 j, and therefore, the upper exterior panel 20A canbe attached to the upper housing member 30A without causing such a gapor an interference. Hence, it is desirable that the fitting direction Daof the attachment target projecting portions 21 and 22 and theattachment holes 30 e and 30 f be inclined with respect to thehorizontal plane Hp3 more greatly than a part inclined most greatly inthe upper exterior panel 20A.

Incidentally, the plurality of attachment holes 30 e and 30 f arepreferably distributed over the entire upper surface of the upperhousing member 30A. This can bring the whole of the upper exterior panel20A into close contact with the upper surface of the upper housingmember 30A. In the example of the electronic apparatus 1, the recessedplate portion 32 a is formed in the upper surface of the upper housingmember 30A. The attachment holes 30 e and 30 f are preferablydistributed in a region other than the recessed plate portion 32 a.

As illustrated in FIG. 22, the attachment target projecting portion 21has an engaging protruding portion 21 a at a base portion thereof. Arecessed portion 30 h is formed in the bottom surface of the attachmenthole 30 e. The engaging protruding portion 21 a is fitted in therecessed portion 30 h and regulates slipping of the attachment targetprojecting portion 21 from the attachment hole 30 e. On the other hand,the attachment target projecting portion 22 has no protruding portion ata base portion thereof. The engaging protruding portion 21 a has asurface 21 b that faces a direction of pulling out the attachment targetprojecting portion 21 from the attachment hole 30 e. At the surface 21b, the engaging protruding portion 21 a engages with the recessedportion 30 h. (The surface 21 b will hereinafter be referred to as alocking surface.) The upper exterior panel 20A holds the upper surfaceof the upper housing member 30A with the locking surface 21 b of theattachment target projecting portion 21 and the attachment targetprojecting portion 22. A plurality of attachment target projectingportions 22 are arranged along a left edge of the upper exterior panel20A. Unlike the attachment target projecting portion 21, no projectingportion may be formed at base portions of the attachment targetprojecting portions 22.

The structure for attachment of the lower exterior panel 20B to thelower housing member 30B may be the same as the structure for attachmentof the upper exterior panel 20A to the upper housing member 30A. Thatis, as illustrated in FIG. 2A, the lower exterior panel 20B may have anattachment target projecting portion 25 having a protruding portionformed at a base portion thereof and an attachment target projectingportion 24 not having such a protruding portion formed thereon.Attachment holes into which the attachment target projecting portions 24and 25 are to be fitted may be formed in the lower surface of the lowerhousing member 30B.

Incidentally, the structure for fixing the upper exterior panel 20A tothe upper housing member 30A is not limited to the example of theelectronic apparatus 1. For example, as illustrated in FIG. 24, engagingprotruding portions 26 may be formed in the lower surface of the upperexterior panel 20A in place of the engaging protruding portion 21 aformed on the base portion of the attachment target projecting portion21. The engaging protruding portions 26 may, for example, be formed suchthat center lines thereof are along the upward-downward direction. Onthe other hand, holes or recessed portions into which the engagingprotruding portions 26 are to be fitted may be formed in the upperhousing member 30A. According to this structure, the size of theprojecting portions is increased easily as compared with the engagingprotruding portion 21 a of the attachment target projecting portion 21.As a result, the strength of the engaging protruding portions can beincreased.

[Disk Insertion Slot]

As illustrated in FIG. 1B and FIG. 25, a disk insertion slot 23 a intowhich an optical disk is to be inserted toward the optical disk drive 6may be formed in the lower exterior panel 20B. The lower exterior panel20B has a front slope 23 on the front side thereof. The front slope 23is a surface that extends obliquely downward and rearward from a frontedge 20 k of the lower exterior panel 20B. The disk insertion slot 23 ais formed in the front slope 23. This can prevent the disk insertionslot 23 a from being conspicuous.

As illustrated in FIG. 25, a guide curved surface 23 c connected to theedge of the disk insertion slot 23 a is formed on an upper portion ofthe disk insertion slot 23 a. The guide curved surface 23 c can functionas a guide for an optical disk D. In a case where a front edge of theoptical disk collides immediately below the front edge 20 k of the lowerexterior panel 20B at a time of insertion of the optical disk D, forexample, the guide curved surface 23 c guides the optical disk D to theinside of the disk insertion slot 23 a.

In the example of the electronic apparatus 1, the disk insertion slot 23a is located in a left portion of the electronic apparatus 1. The frontslope 23 in which the disk insertion slot 23 a is formed is formedobliquely such that a right portion of the front slope 23 (part near thecenter in the left-right direction of the electronic apparatus 1) islocated forward of a left portion of the front slope 23. Therefore, asillustrated in FIG. 1H, a front edge 23 e of the disk insertion slot 23a is inclined frontward from a left end of the front edge 23 e to thecenter (center in the left-right direction) of the electronic apparatus1 in a bottom view of the electronic apparatus 1. Therefore, at a timeof insertion of the optical disk D, the guiding of the optical disk Dstarts early near the center of the electronic apparatus 1.

As illustrated in FIG. 25, a slope 23 d is formed at a lower edge of thedisk insertion slot 23 a. The slope 23 d extends obliquely rearward andupward from a front edge thereof. In a case where the front edge of theoptical disk collides with the slope 23 d, the slope 23 d guides theoptical disk D to an insertion opening 6 c formed in a front surface ofthe disk drive case 6 a.

The insertion opening 6 c formed in the front surface of the disk drivecase 6 a is located above a lower portion of the slope 23 d. Thus, adistance from the insertion opening 6 c to the disk insertion slot 23 aformed in the lower housing member 30B is decreased. As a result, thework of inserting the optical disk D can be facilitated.

As described above, in the electronic apparatus 1, the housing 30includes the upper housing member 30A that covers the upper surface ofthe circuit board 50, and the lower housing member 30B that covers thelower surface of the circuit board 50. The cooling fan 5 is disposed onthe outside of the outer edge of the circuit board 50. The cooling fan 5has the rotational center line Cf along the upward-downward direction asthe thickness direction of the circuit board 50. The cooling fan 5 formsan airflow between the upper surface of the circuit board 50 and theupper housing member 30A and an airflow between the lower surface of thecircuit board 50 and the lower housing member 30B. The upper housingmember 30A has the upper inlet port 31 a defined above the cooling fan5. The lower housing member 30B has the lower inlet port 31 b definedbelow the cooling fan 5. According to the electronic apparatus 1, onecooling fan 5 can send air to both surfaces of the circuit board 50. Itis therefore possible to cool parts disposed on both surfaces of thecircuit board 50 without increasing the number of parts. In addition,because the upper inlet port 31 a and the lower inlet port 31 b areformed in the housing 30, air can be taken in efficiently, so thatcooling performance can be improved.

In addition, the electronic apparatus 1 includes: the first heat sink 71that allows air to pass through in the front-rear direction; the powersupply unit 60 including the power supply circuit 62 and the powersupply unit case 61 housing the power supply circuit 62 and having theintake air wall 61 a in which the plurality of air intake hole 61 b areformed; and the cooling fan 5. The intake air wall 61 a is located infront of the first heat sink 71. In addition, the intake air wall 61 ahas an external surface inclined with respect to both the front-reardirection and the left-right direction and facing the first heat sink71. The cooling fan 5 is disposed so as to send air to the intake airwall. Such an intake air wall 61 a makes it possible to secure anairflow to be supplied to the first heat sink 71, and to cool the powersupply unit 60 by a cold air (air not warmed by another heat generatingdevice or heat radiating device) at the same time. When the power supplyunit 60 can be cooled by the cold air, a clearance between the circuitparts 62 a and 62 b included in the power supply circuit 62 (forexample, a transformer and a capacitor) can be reduced, so that thepower supply unit 60 can be miniaturized.

In addition, the electronic apparatus 1 includes: the circuit board 50;the cooling fan 5 that forms an airflow for cooling parts mounted on thecircuit board 50; the flow passage wall 34A that defines the flowpassage of the airflow sent out from the cooling fan 5; and the dustcollecting chamber Ds that captures dust in the airflow and collects thecaptured dust, the dust collecting chamber Ds being provided to the flowpassage wall 34A. According to this structure, it is possible to reducean amount of dust that enters devices arranged downstream of the dustcollecting chamber Ds, the devices being the first heat sink 71, thepower supply unit 60, and the like. In addition, the dust collectingchamber Ds has the first opening A1 that opens toward the air flowpassage Sa in a direction along the circuit board 50, and the secondopening A2 that opens to the outside of the dust collecting chamber Dsin a direction intersecting the circuit board 50. In the example of theelectronic apparatus 1, the direction in which the second opening A2opens is a direction orthogonal to the circuit board 50. According tothis structure of the dust collecting chamber Ds, the dust can becollected in the dust collecting chamber Ds, and the collected dust canbe discharged through the second opening A2 by relatively simple work.

In addition, the heat radiating device 70 includes: the plurality ofheat pipes 73A to 73F located above the integrated circuit 50 a and eachhaving the heat receiving portion 73 a thermally connected to theintegrated circuit 50 a; and the heat sinks 71 and 72 connected to theplurality of heat pipes 73A to 73F. The heat receiving portions 73 a ofthe heat pipes 73A to 73F are abreast of each other in the left-rightdirection and are in contact with the heat receiving portions 73 a ofadjacent heat pipes 73. The heat receiving portions 73 a have the firstwidth W1 in the upward-downward direction and have the second width W2smaller than the first width W1 in the left-right direction. Accordingto this structure, it becomes easy to increase the number of heat pipes73. As a result, it becomes easy to increase the size of the heat sinks71 and 72 to which the heat of the integrated circuit 50 a istransmitted through the heat pipes 73. Cooling performance for theintegrated circuit 50 a can therefore be improved.

In addition, the electronic apparatus 1 includes: the circuit board 50;the board shield 52 that covers the circuit board 50 and has the opening52 a formed therein; and the heat radiating device 80. The heatradiating device 80 includes: the plurality of fins 81 arranged on theinside of the opening 52 a; the heat pipe 83 that has the connectingportion 83 a located between the plurality of fins 81 and the circuitboard 50 and extending in the left-right direction along the circuitboard 50; and the base plate 82 or 182 that supports the plurality offins 81. The base plate 82 or 182 has the plate left portion 82 c or 182c. The plate left portion 82 c or 182 c covers the lower surface of theheat pipe 83, the lower surface facing the board shield 52 side, andcloses the gap G1 between the left end of the plurality of fins 81 andthe left edge of the opening 52 a of the board shield 52. According tothis structure, it is possible to effectively suppress a leakage ofelectromagnetic waves from the gap G1 between the left end of theplurality of fins 81 and the left edge of the opening 52 a of the boardshield 52.

As described above, in the electronic apparatus 1, the lower surface ofthe circuit board 50 has the shielded region B1 on which the electronicparts 50 c and 50 e are arranged, and the board shield 52 covers theshielded region. The memory housing chamber R1 capable of housing thesemiconductor memory 55 is defined on the outside of the shieldedregion. The board shield 52 has the shield walls 52 e and 52 f along thememory housing chamber R1. Because the shield walls 52 e and 52 f areformed on the board shield 52 in the electronic apparatus 1, thesemiconductor memory 55 can be protected from static electricity whilean increase in the number of parts is suppressed.

As described above, the electronic apparatus 1 includes the upperexterior panel 20A having an upper surface. The upper surface of theupper exterior panel 20A has, on a peripheral portion thereof, the firstposition P1, the second position P2 defined on an opposite side of thecenter Pc of the upper surface from the first position P1, the thirdposition P3, and the fourth position P4 defined on an opposite side ofthe center Pc from the third position P3. The line L1 that connects thefirst position P1 and the second position P2 to each other and is formedalong the upper surface is a curve bulging downward. The line L2 thatconnects the third position P3 and the fourth position P4 to each otherand is formed along the upper surface is a curve bulging upward.According to the electronic apparatus 1, an external appearance isimproved, and a strength of the exterior panel 20A is secured easily.Incidentally, there may be an application to an electronic apparatus nothaving the exterior panel 20A. In such a case, the upper surface of ahousing that houses internal devices such as the circuit board 50 may becurved as described above.

In addition, the electronic apparatus 1 includes the apparatus main body10 having an upper surface and the right side surface 10 b and thecurved upper exterior panel 20A. The upper exterior panel 20A covers theupper surface of the apparatus main body 10 and is attached to the uppersurface. The upper exterior panel 20A has, at an end portion of theupper exterior panel 20A, the right projecting portion 20 a beyond theposition of the right side surface 10 b. According to the electronicapparatus 1, the apparatus main body 10 can be protected by the upperexterior panel 20A when the electronic apparatus 1 is placed verticallysuch that the right side surface 10 b is on the lower side. In addition,because the upper exterior panel 20A is curved, a strength of the upperexterior panel 20A can be secured as compared with a case where theupper exterior panel 20A is in a flat plate shape, for example. Inaddition, the upper exterior panel 20A has a curved section in a cuttingplane that is along the upward-downward direction and that intersectsthe left-right direction (specifically, a cutting plane indicated by theline XXa-XXa in FIG. 1D). According to this, a sufficient strength ofthe exterior panel 20A can be secured. The cutting plane that is alongthe upward-downward direction and intersects the left-right directionmay, for example, be a plane along the upward-downward direction and thefront-rear direction. Also in such a case, a sufficient strength of theexterior panel 20A against an external force acting in the left-rightdirection can be secured.

In addition, the upper exterior panel 20A is a panel to be attached tothe housing 30 having an upper surface and the right side surface 10 band disposed over the housing 30. The upper exterior panel 20 is curved,has the plurality of attachment target projecting portions 21 and 22 tobe respectively attached to the plurality of attachment holes 30 e and30 f formed in the upper surface of the housing 30, and has, at an endportion thereof, the right projecting portion 20 a beyond the positionof the right side surface 10 b. According to the upper exterior panel20A, the apparatus main body 10 can be protected by the upper exteriorpanel 20A when the electronic apparatus 1 is placed such that the rightside surface 10 b is on the lower side.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An electronic apparatus comprising: an apparatusmain body having a first external surface that faces a first directionand a first side surface that faces a second direction orthogonal to thefirst direction; and a first exterior panel curved at least partly,wherein the first exterior panel covers the first external surface andis attached to the first external surface, and the first exterior panelhas, at an end portion of the first exterior panel, a first projectingportion beyond a position of the first side surface.
 2. The electronicapparatus according to claim 1, wherein the apparatus main body includesa first housing member having the first external surface, and a secondhousing member having a second external surface as a surface on anopposite side from the first external surface, and the first housingmember and the second housing member are combined with each other in thefirst direction.
 3. The electronic apparatus according to claim 1,wherein the apparatus main body has a second side surface as a sidesurface on an opposite side from the first side surface, and the firstexterior panel has a second projecting portion beyond a position of thesecond side surface.
 4. The electronic apparatus according to claim 1,wherein the first exterior panel has an end surface having a widthcorresponding to a thickness of the first exterior panel, and the endsurface of the first exterior panel faces the second direction.
 5. Theelectronic apparatus according to claim 1, wherein the first exteriorpanel has a curved section in a cutting plane of the first exteriorpanel, the cutting plane being along the first direction andintersecting the second direction.
 6. The electronic apparatus accordingto claim 1, further comprising: a second exterior panel curved at leastpartly, wherein the apparatus main body has a second external surface asan external surface on an opposite side from the first external surface,the second exterior panel covers the second external surface and isattached to the second external surface, and the second exterior panelhas, at an end portion of the second exterior panel, a third projectingportion beyond a position of the first side surface.
 7. The electronicapparatus according to claim 6, wherein the apparatus main body has asecond side surface as a side surface on an opposite side from the firstside surface, and the second exterior panel has a fourth projectingportion beyond a position of the second side surface.
 8. The electronicapparatus according to claim 1, wherein a plurality of attachmentportions are formed in the first external surface, a plurality ofattachment target portions to be individually fitted into the pluralityof attachment portions formed in the first external surface in a thirddirection are formed on the first exterior panel, and the thirddirection is inclined with respect to a horizontal plane orthogonal tothe first direction.
 9. The electronic apparatus according to claim 8,wherein the first external surface is curved in conformity with curvingof the first exterior panel and has a slope as a part of the firstexternal surface, and an angle between the horizontal plane and thethird direction is larger than an angle between the slope of the firstexternal surface and the horizontal plane.
 10. An exterior panel that isattached to a housing and disposed in a first direction with respect tothe housing, the housing having a first external surface that faces thefirst direction and a first side surface that faces a second directionorthogonal to the first direction, wherein the exterior panel is curvedat least partly, and the exterior panel includes a plurality ofattachment target portions to be individually attached to a plurality ofattachment portions formed in the first external surface of the housing,and, at an end portion of the exterior panel, a first projecting portionbeyond a position of the first side surface.
 11. The exterior panelaccording to claim 10, wherein the exterior panel has the plurality ofattachment target portions to be individually fitted into the pluralityof attachment portions formed in the first external surface of thehousing in a third direction, and the third direction is a directioninclined with respect to a horizontal plane orthogonal to the firstdirection.
 12. The exterior panel according to claim 11, wherein thefirst external surface of the housing is curved in conformity withcurving of the exterior panel and has a slope as a part of the firstexternal surface, and an angle between the horizontal plane and thethird direction is larger than an angle between the slope of the firstexternal surface and the horizontal plane.